4. Power controller (PWR)

4.1 Power supplies

The device requires a 1.8 to 3.6 V operating voltage supply ( \( V_{DD} \) ). An embedded linear voltage regulator is used to supply the internal 1.2 V digital power.

The real-time clock (RTC), the RTC backup registers, and the backup SRAM (BKP SRAM) can be powered from the \( V_{BAT} \) voltage when the main \( V_{DD} \) supply is powered off.

Note: Depending on the operating power supply range, some peripheral may be used with limited functionality and performance. For more details refer to section "General operating conditions" in STM32F72xxx and STM32F73xxx datasheets.

Figure 5. STM32F7x2xx and STM32F73xx power supply overview

Figure 5. STM32F7x2xx and STM32F73xx power supply overview diagram. This block diagram illustrates the power distribution and regulation within the STM32F7x2xx and STM32F73xx microcontrollers. At the top, the VBAT pin (1.65 to 3.6V) is connected to a power switch and a backup circuitry block containing OSC32K, RTC, wakeup logic, backup registers, and backup RAM. Below this, the VDDSDMMC pin is shown with a 100 nF + 1 µF capacitor. The main VDD pin is connected to a voltage regulator and has multiple decoupling capacitors: 12 x 100 nF + 1 x 4.7 µF and 2 x 2.2 µF. The VDDUSB pin is also shown with a 100 nF + 1 µF capacitor. The voltage regulator outputs VCAP_1 and VCAP_2, which are connected to the GP IOs and Level shifter blocks. The Level shifter blocks are connected to the IO Logic. The IO Logic is connected to the Kernel logic (CPU, digital & RAM) and Flash memory. The Reset controller is connected to the PDR_ON pin. The ADC block is connected to the VDDA, VREF+, VREF-, and VSSA pins. The VDDA pin is connected to the VDD pin and has a 100 nF + 1 µF capacitor. The VREF+ and VREF- pins are connected to the VREF pin and have a 100 nF + 1 µF capacitor. The VSSA pin is connected to the VSS pin. The Analog block (RCs, PLL, ...) is connected to the ADC block. The diagram also shows various internal connections and pin numbers (e.g., PG[9..12], PD[6,7], 1/2...11/12).
Figure 5. STM32F7x2xx and STM32F73xx power supply overview diagram. This block diagram illustrates the power distribution and regulation within the STM32F7x2xx and STM32F73xx microcontrollers. At the top, the VBAT pin (1.65 to 3.6V) is connected to a power switch and a backup circuitry block containing OSC32K, RTC, wakeup logic, backup registers, and backup RAM. Below this, the VDDSDMMC pin is shown with a 100 nF + 1 µF capacitor. The main VDD pin is connected to a voltage regulator and has multiple decoupling capacitors: 12 x 100 nF + 1 x 4.7 µF and 2 x 2.2 µF. The VDDUSB pin is also shown with a 100 nF + 1 µF capacitor. The voltage regulator outputs VCAP_1 and VCAP_2, which are connected to the GP IOs and Level shifter blocks. The Level shifter blocks are connected to the IO Logic. The IO Logic is connected to the Kernel logic (CPU, digital & RAM) and Flash memory. The Reset controller is connected to the PDR_ON pin. The ADC block is connected to the VDDA, VREF+, VREF-, and VSSA pins. The VDDA pin is connected to the VDD pin and has a 100 nF + 1 µF capacitor. The VREF+ and VREF- pins are connected to the VREF pin and have a 100 nF + 1 µF capacitor. The VSSA pin is connected to the VSS pin. The Analog block (RCs, PLL, ...) is connected to the ADC block. The diagram also shows various internal connections and pin numbers (e.g., PG[9..12], PD[6,7], 1/2...11/12).

1. \( V_{DDA} \) and \( V_{SSA} \) must be connected to \( V_{DD} \) and \( V_{SS} \) , respectively.

MSv42076V2

Figure 6. STM32F7x3xx and STM32F730xx power supply overview

Power supply overview diagram for STM32F7x3xx and STM32F730xx microcontrollers. The diagram shows various power pins and their connections to internal and external components. VBAT (1.65 to 3.6V) connects to a power switch and backup circuitry (OSC32K, RTC, wakeup logic, backup registers, backup RAM). VDDSDMMC is connected to a 100 nF + 1 µF capacitor and PG[9..12], PD[6,7] pins, which then connect to level shifters for IO Logic. VDDUSB is connected to a 100 nF + 1 µF capacitor and PA[11,12], PB[14,15] pins, which connect to level shifters for IO Logic and an OTG FS PHY. VDD is connected to a 12 x 100 nF + 1 x 4.7 µF capacitor and pins 1/2/...11/12, which connect to a voltage regulator and kernel logic (CPU, digital & RAM). BYPASS_REG connects to the voltage regulator and flash memory. VDD12OTGHS is connected to a 2.2 µF capacitor and OTG HS PHY. OTG_HS_REXT is connected to a 3 Kohm +/-1% resistor and PDR_ON pin, which connects to a reset controller. VDDA is connected to VREF, VREF+, VREF-, and VSSA pins, which connect to an ADC and analog components (RCs, PLL, ...).
Power supply overview diagram for STM32F7x3xx and STM32F730xx microcontrollers. The diagram shows various power pins and their connections to internal and external components. VBAT (1.65 to 3.6V) connects to a power switch and backup circuitry (OSC32K, RTC, wakeup logic, backup registers, backup RAM). VDDSDMMC is connected to a 100 nF + 1 µF capacitor and PG[9..12], PD[6,7] pins, which then connect to level shifters for IO Logic. VDDUSB is connected to a 100 nF + 1 µF capacitor and PA[11,12], PB[14,15] pins, which connect to level shifters for IO Logic and an OTG FS PHY. VDD is connected to a 12 x 100 nF + 1 x 4.7 µF capacitor and pins 1/2/...11/12, which connect to a voltage regulator and kernel logic (CPU, digital & RAM). BYPASS_REG connects to the voltage regulator and flash memory. VDD12OTGHS is connected to a 2.2 µF capacitor and OTG HS PHY. OTG_HS_REXT is connected to a 3 Kohm +/-1% resistor and PDR_ON pin, which connects to a reset controller. VDDA is connected to VREF, VREF+, VREF-, and VSSA pins, which connect to an ADC and analog components (RCs, PLL, ...).

MSv42069V1

1. The V DDUSB allows supplying the PHY FS in PA11/PA12 and the PHY HS on PB14/PB15.

  1. 2. \( V_{DDA} \) and \( V_{SSA} \) must be connected to \( V_{DD} \) and \( V_{SS} \) , respectively.
  2. 3. Refer to STM32F730xx datasheet for more details on available packages supporting the integrated OTG_HS PHY.

4.1.1 Independent A/D converter supply and reference voltage

To improve conversion accuracy, the ADC has an independent power supply which can be separately filtered and shielded from noise on the PCB.

To ensure a better accuracy of low voltage inputs, the user can connect a separate external reference voltage ADC input on \( V_{REF} \) . The voltage on \( V_{REF} \) ranges from 1.8 V to \( V_{DDA} \) .

4.1.2 Independent USB transceivers supply

The \( V_{DDUSB} \) is an independent USB power supply for full speed transceivers (USB OTG FS and USB OTG HS in FS mode). It can be connected either to \( V_{DD} \) or an external independent power supply (3.0 to 3.6V) for USB transceivers (refer Figure 7 and Figure 8 ). For example, when the device is powered at 1.8V, an independent power supply 3.3V can be connected to \( V_{DDUSB} \) . When the \( V_{DDUSB} \) is connected to a separated power supply, it is independent from \( V_{DD} \) or \( V_{DDA} \) but it must be the last supply to be provided and the first to disappear. The following conditions \( V_{DDUSB} \) must be respected:

Figure 7. \( V_{DDUSB} \) connected to \( V_{DD} \) power supply

Figure 7: Graph showing VDD voltage over time when VDDUSB is connected to VDD power supply. The y-axis is labeled VDD with markers for VDD_MAX and VDD_MIN. The x-axis is labeled time with markers for Power-on, Operating mode, and Power-down. The voltage curve rises from 0V at Power-on to a plateau at VDD = VDDA = VDDUSB during Operating mode, and then falls back to 0V at Power-down. The label MS37591V1 is in the bottom right corner.
Figure 7: Graph showing VDD voltage over time when VDDUSB is connected to VDD power supply. The y-axis is labeled VDD with markers for VDD_MAX and VDD_MIN. The x-axis is labeled time with markers for Power-on, Operating mode, and Power-down. The voltage curve rises from 0V at Power-on to a plateau at VDD = VDDA = VDDUSB during Operating mode, and then falls back to 0V at Power-down. The label MS37591V1 is in the bottom right corner.

Figure 8. \( V_{DDUSB} \) connected to external independent power supply

Figure 8: Graph showing VDD and VDDUSB voltages over time when VDDUSB is connected to an external independent power supply. The y-axis has markers for VDDUSB_MAX, VDDUSB_MIN, and VDD_MIN. The x-axis is labeled time with markers for Power-on, Operating mode, and Power-down. The VDD curve (black) rises from 0V at Power-on to a plateau at VDD = VDDA during Operating mode, and falls to 0V at Power-down. The VDDUSB curve (blue) rises from 0V at Power-on to a plateau at VDDUSB during Operating mode, and falls to 0V at Power-down. The Operating mode is divided into three regions: 'USB non functional area' (pink) at the beginning and end, and 'USB functional area' (blue) in the middle. The label MS37590V1 is in the bottom right corner.
Figure 8: Graph showing VDD and VDDUSB voltages over time when VDDUSB is connected to an external independent power supply. The y-axis has markers for VDDUSB_MAX, VDDUSB_MIN, and VDD_MIN. The x-axis is labeled time with markers for Power-on, Operating mode, and Power-down. The VDD curve (black) rises from 0V at Power-on to a plateau at VDD = VDDA during Operating mode, and falls to 0V at Power-down. The VDDUSB curve (blue) rises from 0V at Power-on to a plateau at VDDUSB during Operating mode, and falls to 0V at Power-down. The Operating mode is divided into three regions: 'USB non functional area' (pink) at the beginning and end, and 'USB functional area' (blue) in the middle. The label MS37590V1 is in the bottom right corner.

In the STM32F7x3xx and STM32F730xx devices, the USB PHY HS sub-system uses an additional power supply pin:

Note: The PHY HS has another OTG_HS_REXT pin needed for calibration. This pin must be connected to gnd via an external precise resistor (3 K \( \Omega \) \( \pm \) 1%).

4.1.3 Battery backup domain

Backup domain description

To retain the content of the RTC backup registers, backup SRAM, and supply the RTC when \( V_{DD} \) is turned off, \( V_{BAT} \) pin can be connected to an optional standby voltage supplied by a battery or by another source.

To allow the RTC to operate even when the main digital supply ( \( V_{DD} \) ) is turned off, the \( V_{BAT} \) pin powers the following blocks:

The switch to the \( V_{BAT} \) supply is controlled by the power-down reset embedded in the Reset block.


Warning: During \( t_{RSTTEMPO} \) (temporization at \( V_{DD} \) startup) or after a PDR is detected, the power switch between \( V_{BAT} \) and \( V_{DD} \) remains connected to \( V_{BAT} \) .
During the startup phase, if \( V_{DD} \) is established in less than \( t_{RSTTEMPO} \) (Refer to the datasheet for the value of \( t_{RSTTEMPO} \) ) and \( V_{DD} > V_{BAT} + 0.6\text{ V} \) , a current may be injected into \( V_{BAT} \) through an internal diode connected between \( V_{DD} \) and the power switch ( \( V_{BAT} \) ).
If the power supply/battery connected to the \( V_{BAT} \) pin cannot support this current injection, it is strongly recommended to connect an external low-drop diode between this power supply and the \( V_{BAT} \) pin.


If no external battery is used in the application, it is recommended to connect the \( V_{BAT} \) externally to \( V_{DD} \) through a 100 nF external ceramic capacitor.

When the backup domain is supplied by \( V_{DD} \) (analog switch connected to \( V_{DD} \) ), the following functions are available:

Note: Due to the fact that the switch only sinks a limited amount of current (3 mA), the use of GPIOs PI8 and PC13 to PC15 are restricted: the speed has to be limited to 2 MHz with a maximum load of 30 pF and these I/Os must not be used as a current source (e.g. to drive an LED).

When the backup domain is supplied by \( V_{BAT} \) (analog switch connected to \( V_{BAT} \) because \( V_{DD} \) is not present), the following functions are available:

Backup domain access

After reset, the backup domain (RTC registers, RTC backup register and backup SRAM) is protected against possible unwanted write accesses. To enable access to the backup domain, proceed as follows:

RTC and RTC backup registers

The real-time clock (RTC) is an independent BCD timer/counter. The RTC provides a time-of-day clock/calendar, two programmable alarm interrupts, and a periodic programmable wakeup flag with interrupt capability. The RTC contains 32 backup data registers (128 bytes) which are reset when a tamper detection event occurs. For more details refer to Section 25: Real-time clock (RTC) .

Backup SRAM

The backup domain includes 4 Kbytes of backup SRAM addressed in 32-bit, 16-bit or 8-bit mode. Its content is retained even in Standby or \( V_{BAT} \) mode when the low-power backup regulator is enabled. It can be considered as an internal EEPROM when \( V_{BAT} \) is always present.

When the backup domain is supplied by \( V_{DD} \) (analog switch connected to \( V_{DD} \) ), the backup SRAM is powered from \( V_{DD} \) which replaces the \( V_{BAT} \) power supply to save battery life.

When the backup domain is supplied by \( V_{BAT} \) (analog switch connected to \( V_{BAT} \) because \( V_{DD} \) is not present), the backup SRAM is powered by a dedicated low-power regulator. This regulator can be ON or OFF depending whether the application needs the backup SRAM function in Standby and \( V_{BAT} \) modes or not. The power-down of this regulator is controlled by a dedicated bit, the BRE control bit of the PWR_CSR1 register (see Section 4.4.2: PWR power control/status register (PWR_CSR1) ).

The backup SRAM is not mass erased by a tamper event. It is read protected to prevent confidential data, such as cryptographic private key, from being accessed. The backup SRAM can be erased only through the Flash interface when a protection level change from level 1 to level 0 is requested. Refer to the description of Read protection (RDP) option byte.

Figure 9. Backup domain

Figure 9. Backup domain block diagram showing the interaction between the 1.2 V domain and the Backup domain. The 1.2 V domain contains a Voltage regulator (3.3 to 1.2 V) and a Backup SRAM interface. The Backup domain contains a Power switch, an LP voltage regulator (3.3 to 1.2 V), Backup SRAM 1.2 V, RTC, and LSE 32.768 Hz. Connections show power and data flow between these components.
graph LR
    subgraph Main_Domain [1.2 V domain]
        VR[Voltage regulator
3.3 -> 1.2 V] BSIF[Backup SRAM
interface] VR --> BSIF end subgraph Backup_Domain [Backup domain] PS[Power switch] LPVR[LP voltage regulator
3.3 -> 1.2 V] BSRAM[Backup SRAM
1.2 V] RTC[RTC] LSE[LSE 32.768 Hz] PS --- LPVR PS --> BSRAM BSRAM <--> RTC RTC <--> LSE end BSIF <--> BSRAM

MS30430V1

Figure 9. Backup domain block diagram showing the interaction between the 1.2 V domain and the Backup domain. The 1.2 V domain contains a Voltage regulator (3.3 to 1.2 V) and a Backup SRAM interface. The Backup domain contains a Power switch, an LP voltage regulator (3.3 to 1.2 V), Backup SRAM 1.2 V, RTC, and LSE 32.768 Hz. Connections show power and data flow between these components.

4.1.4 Voltage regulator

An embedded linear voltage regulator supplies all the digital circuitries except for the backup domain and the Standby circuitry. The regulator output voltage is around 1.2 V.

This voltage regulator requires two external capacitors to be connected to two dedicated pins, \( V_{CAP\_1} \) and \( V_{CAP\_2} \) available in all packages. Specific pins must be connected either to \( V_{SS} \) or \( V_{DD} \) to activate or deactivate the voltage regulator. These pins depend on the package.

When activated by software, the voltage regulator is always enabled after Reset. It works in three different modes depending on the application modes (Run, Stop, or Standby mode).

The voltage scaling allows optimizing the power consumption when the device is clocked below the maximum system frequency. After exit from Stop mode, the voltage

scale 3 is automatically selected. (see Section 4.4.1: PWR power control register (PWR_CR1) ).

2 operating modes are available:

The voltage regulator can be put either in main regulator mode (MR) or in low-power mode (LPR). Both modes can be configured by software as follows:

Note: Over-drive and under-drive mode are not available when the regulator is bypassed. For more details, refer to the voltage regulator section in the datasheets.

Table 13. Voltage regulator configuration mode versus device operating mode (1)

Voltage regulator configurationRun modeSleep modeStop modeStandby mode
Normal modeMRMRMR or LPR-
Over-drive mode (2)MRMR--
Under-drive mode--MR or LPR-
Power-down mode---Yes

1. '-' means that the corresponding configuration is not available.

2. The over-drive mode is not available when \( V_{DD} = 1.8 \) to \( 2.1 \) V.

Entering Over-drive mode

It is recommended to enter Over-drive mode when the application is not running critical tasks and when the system clock source is either HSI or HSE. To optimize the configuration time, enable the Over-drive mode during the PLL lock phase.

To enter Over-drive mode, follow the sequence below:

  1. 1. Select HSI or HSE as system clock.
  2. 2. Configure RCC_PLLCFGR register and set PLLON bit of RCC_CR register.
  3. 3. Set ODEN bit of PWR_CR1 register to enable the Over-drive mode and wait for the ODRDY flag to be set in the PWR_CSR1 register.
  4. 4. Set the ODSW bit in the PWR_CR1 register to switch the voltage regulator from Normal mode to Over-drive mode. The System will be stalled during the switch but the PLL clock system will be still running during locking phase.
  5. 5. Wait for the ODSWRDY flag in the PWR_CSR1 to be set.
  6. 6. Select the required Flash latency as well as AHB and APB prescalers.
  7. 7. Wait for PLL lock.
  8. 8. Switch the system clock to the PLL.
  9. 9. Enable the peripherals that are not generated by the System PLL (I2S clock, SAI1 clock, USB_48MHz clock....).

Note: The PLLI2S and PLLSAI can be configured at the same time as the system PLL.

During the Over-drive switch activation, no peripheral clocks should be enabled. The peripheral clocks must be enabled once the Over-drive mode is activated.

Entering Stop mode disables the Over-drive mode, as well as the PLL. The application software has to configure again the Over-drive mode and the PLL after exiting from Stop mode.

Exiting from Over-drive mode

It is recommended to exit from Over-drive mode when the application is not running critical tasks and when the system clock source is either HSI or HSE. There are two sequences that allow exiting from over-drive mode:

Example of sequence 1:

  1. 1. Select HSI or HSE as system clock source.
  2. 2. Disable the peripheral clocks that are not generated by the System PLL (I2S clock, SAI1 clock, USB_48MHz clock,...)
  3. 3. Reset simultaneously the ODEN and the ODSW bits in the PWR_CR1 register to switch back the voltage regulator to Normal mode and disable the Over-drive mode.
  4. 4. Wait for the ODWRRDY flag of PWR_CSR1 to be reset.

Example of sequence 2:

  1. 1. Select HSI or HSE as system clock source.
  2. 2. Disable the peripheral clocks that are not generated by the System PLL (I2S clock, SAI1 clock, USB_48MHz clock,...).
  3. 3. Reset the ODSW bit in the PWR_CR1 register to switch back the voltage regulator to Normal mode. The system clock is stalled during voltage switching.
  4. 4. Wait for the ODWRDY flag of PWR_CSR1 to be reset.
  5. 5. Reset the ODEN bit in the PWR_CR1 register to disable the Over-drive mode.

Note: During step 3, the ODEN bit remains set and the Over-drive mode is still enabled but not active (ODSW bit is reset). If the ODEN bit is reset instead, the Over-drive mode is disabled and the voltage regulator is switched back to the initial voltage.

4.2 Power supply supervisor

4.2.1 Power-on reset (POR)/power-down reset (PDR)

The device has an integrated POR/PDR circuitry that allows proper operation starting from 1.8 V.

The device remains in Reset mode when \( V_{DD}/V_{DDA} \) is below a specified threshold, \( V_{POR/PDR} \) , without the need for an external reset circuit. For more details concerning the power on/power-down reset threshold, refer to the electrical characteristics of the datasheet.

Figure 10. Power-on reset/power-down reset waveform

Figure 10. Power-on reset/power-down reset waveform. The graph shows the relationship between VDD/VDDA voltage and the Reset signal. The top plot shows VDD/VDDA rising and then falling. The bottom plot shows the Reset signal going high when VDD/VDDA is below the PDR threshold and returning low when it is above. The PDR threshold has a 40 mV hysteresis. The time between the voltage crossing the threshold and the Reset signal changing is labeled tRSTTEMPO (Temporization).

The figure illustrates the power-on reset (POR) and power-down reset (PDR) waveform. The top graph shows the supply voltage \( V_{DD}/V_{DDA} \) rising from 0 V to a maximum value and then falling. The bottom graph shows the Reset signal, which is active low. The Reset signal goes high when the supply voltage falls below the PDR threshold and returns low when the supply voltage rises above the PDR threshold. The PDR threshold has a 40 mV hysteresis. The time between the voltage crossing the threshold and the Reset signal changing is labeled \( t_{RSTTEMPO} \) (Temporization).

Figure 10. Power-on reset/power-down reset waveform. The graph shows the relationship between VDD/VDDA voltage and the Reset signal. The top plot shows VDD/VDDA rising and then falling. The bottom plot shows the Reset signal going high when VDD/VDDA is below the PDR threshold and returning low when it is above. The PDR threshold has a 40 mV hysteresis. The time between the voltage crossing the threshold and the Reset signal changing is labeled tRSTTEMPO (Temporization).

4.2.2 Brownout reset (BOR)

During power on, the Brownout reset (BOR) keeps the device under reset until the supply voltage reaches the specified \( V_{BOR} \) threshold.

\( V_{BOR} \) is configured through device option bytes. By default, BOR is off. 3 programmable \( V_{BOR} \) threshold levels can be selected:

Note: For full details about BOR characteristics, refer to the "Electrical characteristics" section in the device datasheet.

When the supply voltage ( \( V_{DD} \) ) drops below the selected \( V_{BOR} \) threshold, a device reset is generated.

The BOR can be disabled by programming the device option bytes. In this case, the power-on and power-down is then monitored by the POR/ PDR (see Section 4.2.1: Power-on reset (POR)/power-down reset (PDR) ).

The BOR threshold hysteresis is \( \sim 100 \) mV (between the rising and the falling edge of the supply voltage).

Figure 11. BOR thresholds

Figure 11. BOR thresholds. A graph showing the supply voltage (VDD/VDDA) over time. The voltage rises linearly, then drops linearly. A horizontal dashed line indicates the BOR threshold. The hysteresis is shown as the vertical distance between the rising and falling edges of the voltage at the threshold, labeled '100 mV hysteresis'. Below the graph, a 'Reset' signal is shown as a horizontal line that goes high when the voltage drops below the threshold and goes low when it rises above it. The diagram is labeled MS30433V1.
Figure 11. BOR thresholds. A graph showing the supply voltage (VDD/VDDA) over time. The voltage rises linearly, then drops linearly. A horizontal dashed line indicates the BOR threshold. The hysteresis is shown as the vertical distance between the rising and falling edges of the voltage at the threshold, labeled '100 mV hysteresis'. Below the graph, a 'Reset' signal is shown as a horizontal line that goes high when the voltage drops below the threshold and goes low when it rises above it. The diagram is labeled MS30433V1.

4.2.3 Programmable voltage detector (PVD)

You can use the PVD to monitor the \( V_{DD} \) power supply by comparing it to a threshold selected by the PLS[2:0] bits in the PWR power control register (PWR_CR1) .

The PVD is enabled by setting the PVDE bit.

A PVDO flag is available, in the PWR power control/status register (PWR_CSR1) , to indicate if \( V_{DD} \) is higher or lower than the PVD threshold. This event is internally connected

to the EXTI line16 and can generate an interrupt if enabled through the EXTI registers. The PVD output interrupt can be generated when \( V_{DD} \) drops below the PVD threshold and/or when \( V_{DD} \) rises above the PVD threshold depending on EXTI line16 rising/falling edge configuration. As an example the service routine could perform emergency shutdown tasks.

Figure 12. PVD thresholds

Figure 12. PVD thresholds. A graph showing VDD (Supply Voltage) on the y-axis and time on the x-axis. The VDD signal rises to a peak and then falls. A horizontal dashed line represents the PVD threshold. A vertical double-headed arrow indicates a 100 mV hysteresis between the rising and falling edges of the VDD signal relative to the PVD threshold. Below the graph, a signal labeled 'PVD output' is shown as a rectangular pulse that goes low when VDD drops below the threshold and returns high when VDD rises above the threshold. The identifier MS30432V2 is in the bottom right corner.

The figure illustrates the relationship between the supply voltage ( \( V_{DD} \) ) and the Power Voltage Detector (PVD) output. The top graph shows \( V_{DD} \) rising and then falling over time. A horizontal dashed line marks the PVD threshold. A vertical double-headed arrow indicates a 100 mV hysteresis between the rising and falling edges of the \( V_{DD} \) signal relative to the threshold. The bottom graph shows the PVD output as a rectangular pulse that goes low when \( V_{DD} \) drops below the threshold and returns high when \( V_{DD} \) rises above the threshold. The identifier MS30432V2 is in the bottom right corner.

Figure 12. PVD thresholds. A graph showing VDD (Supply Voltage) on the y-axis and time on the x-axis. The VDD signal rises to a peak and then falls. A horizontal dashed line represents the PVD threshold. A vertical double-headed arrow indicates a 100 mV hysteresis between the rising and falling edges of the VDD signal relative to the PVD threshold. Below the graph, a signal labeled 'PVD output' is shown as a rectangular pulse that goes low when VDD drops below the threshold and returns high when VDD rises above the threshold. The identifier MS30432V2 is in the bottom right corner.

4.3 Low-power modes

By default, the microcontroller is in Run mode after a system or a power-on reset. In Run mode the CPU is clocked by HCLK and the program code is executed. Several low-power modes are available to save power when the CPU does not need to be kept running, for example when waiting for an external event. It is up to the user to select the mode that gives the best compromise between low-power consumption, short startup time and available wakeup sources.

The devices feature three low-power modes:

In addition, the power consumption in Run mode can be reduced by one of the following means:

Entering low-power mode

Low-power modes are entered by the MCU by executing the WFI (Wait For Interrupt), or WFE (Wait for Event) instructions, or when the SLEEPONEXIT bit in the Cortex ® -M7 System Control register is set on Return from ISR.

Entering Low-power mode through WFI or WFE will be executed only if no interrupt is pending or no event is pending.

Exiting low-power mode

The MCU exits from Sleep and Stop modes low-power mode depending on the way the low-power mode was entered:

When SEVONPEND = 0 in the Cortex®-M7 System Control register: by enabling an interrupt in the peripheral control register and in the NVIC. When the MCU resumes from WFE, the peripheral interrupt pending bit and the NVIC peripheral IRQ channel pending bit (in the NVIC interrupt clear pending register) have to be cleared. Only NVIC interrupts with sufficient priority will wakeup and interrupt the MCU.

When SEVONPEND = 1 in the Cortex®-M7 System Control register: by enabling an interrupt in the peripheral control register and optionally in the NVIC. When the MCU resumes from WFE, the peripheral interrupt pending bit and when enabled the NVIC peripheral IRQ channel pending bit (in the NVIC interrupt clear pending register) have to be cleared. All NVIC interrupts will wakeup the MCU, even the disabled ones. Only enabled NVIC interrupts with sufficient priority will wakeup and interrupt the MCU.

This is done by configuring a EXTI line in event mode. When the CPU resumes from WFE, it is not necessary to clear the EXTI peripheral interrupt pending bit or the NVIC IRQ channel pending bit as the pending bits corresponding to the event line is not set. It may be necessary to clear the interrupt flag in the peripheral.

The MCU exits from Standby low-power mode through an external reset (NRST pin), an IWDG reset, a rising or falling on one of the enabled WKUPx pins or a RTC event occurs (see Figure 287: RTC block diagram ).

After waking up from Standby mode, program execution restarts in the same way as after a Reset (boot pin sampling, option bytes loading, reset vector is fetched, etc.).

Only enabled NVIC interrupts with sufficient priority will wakeup and interrupt the MCU.

Table 14. Low-power mode summary

Mode nameEntryWakeupEffect on 1.2 V domain clocksEffect on V DD domain clocksVoltage regulator
Sleep
(Sleep now
or Sleep-on-exit)
WFIAny interruptCPU CLK OFF
no effect on other
clocks or analog
clock sources
NoneON
WFEWakeup event

Table 14. Low-power mode summary (continued)

Mode nameEntryWakeupEffect on 1.2 V domain clocksEffect on V DD domain clocksVoltage regulator
StopSLEEPDEEP bit + WFI or WFEAny EXTI line (configured in the EXTI registers, internal and external lines)All 1.2 V domain clocks OFFHSI and HSE oscillators OFFMain regulator or Low-power regulator (depends on PWR power control register (PWR_CR1) )
StandbyPDDS bit + SLEEPDEEP bit + WFI or WFEWKUP pin rising or falling edge, RTC alarm (Alarm A or Alarm B), RTC Wakeup event, RTC tamper events, RTC time stamp event, external reset in NRST pin, IWDG resetOFF

Table 15. Features over all modes (1)

PeripheralRunSleepStopStandbyVBAT
WakeupWakeup
CPUY------
Flash accessYY-----
DTCM RAMYYY----
ITCM RAMYYY----
SRAM1YYY----
SRAM2YYY----
FMCOO-----
QUADSPIOO-----
Backup RegistersYYY-Y-Y
Backup RAMYYY-Y-Y
Brown-out reset (BOR)YYYYYY-
Programmable voltage detector (PVD)OOOO---
High Speed Internal (HSI)OO(2)----
High Speed External (HSE)OO-----
Low Speed Internal (LSI)OOO-O--
Low Speed External (LSE)OOO-O-O
RTCOOOOOOO
Table 15. Features over all modes (continued) (1)
PeripheralRunSleepStopStandbyVBAT
WakeupWakeup
Number of RTC tamper pins3333332
CRC calculation unitOO-----
GPIOsYYYY-6 pins2 tamper
DMAOO-----
USARTx (x=1..8)OO-----
I2Cx (x=1,2,3)OO-----
SPIx (x=1..5)OO-----
SAIx (x=1,2)OO-----
ADCx (x=1,2,3)OO-----
DACx (x=1,2)OO-----
Temperature sensorOO-----
Timers (TIMx)OO-----
Low-power timer 1 (LPTIM1)OOOO---
Independent watchdog (IWDG)OOOOOO-
Window watchdog (WWDG)OO-----
Systick timerOO-----
Random number generator (RNG)OO-----
AES processor (AES)OO-----
SDMMC1/2OO-----
CAN1OO-----
USB OTG FSOO-O---
USB OTG HSOO-O---

1. Legend: Y = Yes (Enable), O = Optional (Disable by default. Can be enabled by software). - = Not available. Wakeup highlighted in gray.

2. Some peripherals with wakeup from Stop capability can request HSI to be enabled. In this case, HSI is woken up by the peripheral, and only feeds the peripheral which requested it. HSI is automatically put off when the peripheral does not need it anymore.

4.3.1 Debug mode

By default, the debug connection is lost when the device enters in Stop or Standby mode while the debug features are used. This is due to the fact that the Cortex ® -M7 core is no longer clocked.

However, by setting some configuration bits in the DBGMCU_CR register, the software can be debugged even when using the low-power modes extensively. For more details, refer to Section 34.16.1: Debug support for low-power modes .

4.3.2 Run mode

Slowing down system clocks

In Run mode the speed of the system clocks (SYSCLK, HCLK, PCLK1, PCLK2) can be reduced by programming the prescaler registers. These prescalers can also be used to slow down peripherals before entering Sleep mode.

For more details refer to Section 5.3.3: RCC clock configuration register (RCC_CFGR) .

Peripheral clock gating

In Run mode, the HCLKx and PCLKx for individual peripherals and memories can be stopped at any time to reduce power consumption.

To further reduce power consumption in Sleep mode the peripheral clocks can be disabled prior to executing the WFI or WFE instructions.

Peripheral clock gating is controlled by the AHB1 peripheral clock enable register (RCC_AHB1ENR), AHB2 peripheral clock enable register (RCC_AHB2ENR), AHB3 peripheral clock enable register (RCC_AHB3ENR) (see Section 5.3.10: RCC AHB1 peripheral clock register (RCC_AHB1ENR) , Section 5.3.11: RCC AHB2 peripheral clock enable register (RCC_AHB2ENR) , and Section 5.3.12: RCC AHB3 peripheral clock enable register (RCC_AHB3ENR) ).

Disabling the peripherals clocks in Sleep mode can be performed automatically by resetting the corresponding bit in RCC_AHBxLPENR and RCC_APBxLPENR registers.

4.3.3 Low-power mode

Entering low-power mode

Low-power modes are entered by the MCU executing the WFI (Wait For Interrupt), or WFE (Wait For Event) instructions, or when the SLEEPONEXIT bit in the Cortex ® -M7 System Control register is set on Return from ISR.

Exiting low-power mode

From Sleep and Stop modes the MCU exits low-power mode depending on the way the mode was entered:

By enabling an interrupt in the peripheral control register and in the NVIC. When the MCU resumes from WFE, the peripheral interrupt pending bit and the NVIC

peripheral IRQ channel pending bit (in the NVIC interrupt clear pending register) have to be cleared.

Only NVIC interrupts with sufficient priority will wakeup and interrupt the MCU.

- When SEVEONPEND=1 in the Cortex ® -M7 System Control register.

By enabling an interrupt in the peripheral control register and optionally in the NVIC. When the MCU resumes from WFE, the peripheral interrupt pending bit and (when enabled) the NVIC peripheral IRQ channel pending bit (in the NVIC interrupt clear pending register) have to be cleared.

All NVIC interrupts will wakeup the MCU, even the disabled ones.

Only enabled NVIC interrupts with sufficient priority will wakeup and interrupt the MCU.

- Event

Configuring a EXTI line in event mode. When the CPU resumes from WFE, it is not necessary to clear the EXTI peripheral interrupt pending bit or the NVIC IRQ channel pending bit as the pending bits corresponding to the event line is not set. It may be necessary to clear the interrupt flag in the peripheral.

From Standby mode the MCU exits Low-power mode through an external reset (NRST pin), an IWDG reset, a rising edge on one of the enabled WKUPx pins or a RTC event (see Figure 287: RTC block diagram ).

4.3.4 Sleep mode

I/O states in Sleep mode

In Sleep mode, all I/O pins keep the same state as in Run mode.

Entering Sleep mode

The Sleep mode is entered by executing the WFI (Wait For Interrupt) or WFE (Wait for Event) instructions. Two options are available to select the Sleep mode entry mechanism, depending on the SLEEPONEXIT bit in the Cortex ® -M7 System Control register:

Refer to Table 16 and Table 17 for details on how to enter Sleep mode.

Exiting Sleep mode

If the WFI instruction is used to enter Sleep mode, any peripheral interrupt acknowledged by the nested vectored interrupt controller (NVIC) can wake up the device from Sleep mode.

If the WFE instruction is used to enter Sleep mode, the MCU exits Sleep mode as soon as an event occurs. The wakeup event can be generated either by:

This mode offers the lowest wakeup time as no time is wasted in interrupt entry/exit.
Refer to Table 16 and Table 17 for more details on how to exit Sleep mode.

Table 16. Sleep-now entry and exit
Sleep-now modeDescription
Mode entry

WFI (Wait for Interrupt) or WFE (Wait for Event) while:

  • – SLEEPDEEP = 0, and
  • – No interrupt (for WFI) or event (for WFE) is pending.

Refer to the Cortex®-M7 System Control register.

On Return from ISR while:

  • – SLEEPDEEP = 0 and
  • – SLEEPONEXIT = 1,
  • – No interrupt is pending.

Refer to the Cortex®-M7 System Control register.

Mode exit

If WFI or Return from ISR was used for entry:

Interrupt: Refer to Table 36: STM32F72xxx and STM32F73xxx vector table

If WFE was used for entry and SEVONPEND = 0

Wakeup event: Refer to Section 10.3: Wakeup event management

If WFE was used for entry and SEVONPEND = 1

Interrupt even when disabled in NVIC: refer to Table 36: STM32F72xxx and STM32F73xxx vector table and Wakeup event (see Section 10.3: Wakeup event management ).

Wakeup latencyNone
Table 17. Sleep-on-exit entry and exit
Sleep-on-exitDescription
Mode entry

WFI (Wait for Interrupt) or WFE (Wait for Event) while:

  • – SLEEPDEEP = 0, and
  • – No interrupt (for WFI) or event (for WFE) is pending.

Refer to the Cortex®-M7 System Control register.

On Return from ISR while:

  • – SLEEPDEEP = 0, and
  • – SLEEPONEXIT = 1, and
  • – No interrupt is pending.

Refer to the Cortex®-M7 System Control register.

Mode exitInterrupt: refer to Table 36: STM32F72xxx and STM32F73xxx vector table
Wakeup latencyNone

4.3.5 Stop mode

The Stop mode is based on the Cortex®-M7 deepsleep mode combined with peripheral clock gating. The voltage regulator can be configured either in normal or low-power mode. In Stop mode, all clocks in the 1.2 V domain are stopped, the PLLs, the HSI and the HSE RC oscillators are disabled. Internal SRAM and register contents are preserved.

In Stop mode, the power consumption can be further reduced by using additional settings in the PWR_CR1 register. However this will induce an additional startup delay when waking up from Stop mode (see Table 18 ).

Table 18. Stop operating modes

Voltage Regulator ModeUDEN[1:0] bitsMRUDS bitLPUDS bitLPDS bitFPDS bitWakeup latency
Normal modeSTOP MR (Main Regulator)-0-00HSI RC startup time
STOP MR- FPD-0-01HSI RC startup time + Flash wakeup time from power-down mode
STOP LP-0010HSI RC startup time + regulator wakeup time from LP mode
STOP LP-FPD--011HSI RC startup time + Flash wakeup time from power-down mode + regulator wakeup time from LP mode
Under-drive ModeSTOP UMR-FPD31-0-HSI RC startup time + Flash wakeup time from power-down mode + Main regulator wakeup time from under-drive mode + Core logic to nominal mode
STOP ULP-FPD3-11-HSI RC startup time + Flash wakeup time from power-down mode + regulator wakeup time from LP under-drive mode + Core logic to nominal mode

I/O states in Stop mode

In stop mode, all I/Os pins keep the same state as in the run mode

Entering Stop mode

The Stop mode is entered according to Entering low-power mode , when the SLEEPDEEP bit in Cortex®-M7 System Control register is set.

Refer to Table 19 for details on how to enter the Stop mode.

When the microcontroller enters in Stop mode, the voltage scale 3 is automatically selected. To further reduce power consumption in Stop mode, the internal voltage regulator can be put in low-power or low voltage mode. This is configured by the LPDS, MRUDS, LPUDS and UDEN bits of the PWR power control register (PWR_CR1) .

If Flash memory programming is ongoing, the Stop mode entry is delayed until the memory access is finished.

If an access to the APB domain is ongoing, The Stop mode entry is delayed until the APB access is finished.

If the Over-drive mode was enabled before entering Stop mode, it is automatically disabled during when the Stop mode is activated.

In Stop mode, the following features can be selected by programming individual control bits:

The ADC or DAC can also consume power during the Stop mode, unless they are disabled before entering it. To disable them, the ADON bit in the ADC_CR2 register and the ENx bit in the DAC_CR register must both be written to 0.

Note: Before entering Stop mode, it is recommended to enable the clock security system (CSS) feature to prevent external oscillator (HSE) failure from impacting the internal MCU behavior.

Exiting Stop mode

Refer to Table 19 for more details on how to exit Stop mode.

When exiting Stop mode by issuing an interrupt or a wakeup event, the HSI RC oscillator is selected as system clock.

If the Under-drive mode was enabled, it is automatically disabled after exiting Stop mode.

When the voltage regulator operates in low-power mode, an additional startup delay is incurred when waking up from Stop mode. By keeping the internal regulator ON during Stop mode, the consumption is higher although the startup time is reduced.

When the voltage regulator operates in Under-drive mode, an additional startup delay is induced when waking up from Stop mode.

Table 19. Stop mode entry and exit (STM32F72xxx and STM32F73xxx)

Stop modeDescription
Mode entry

WFI (Wait for Interrupt) or WFE (Wait for Event) while:

  • – No interrupt (for WFI) or event (for WFE) is pending.
  • – SLEEPDEEP bit is set in Cortex®-M7 System Control register,
  • – PDDS bit is cleared in Power Control register (PWR_CR1),
  • – Select the voltage regulator mode by configuring LPDS, MRUDS, LPUDS and UDEN bits in PWR_CR (see Table 18: Stop operating modes ).

On Return from ISR while:

  • – No interrupt is pending,
  • – SLEEPDEEP bit is set in Cortex®-M7 System Control register, and
  • – SLEEPONEXIT = 1, and
  • – PDDS is cleared in Power Control register (PWR_CR1).

Note: To enter Stop mode, all EXTI Line pending bits (in Pending register (EXTI_PR)), all peripheral interrupts pending bits, the RTC Alarm (Alarm A and Alarm B), RTC wakeup, RTC tamper, and RTC time stamp flags, must be reset. Otherwise, the Stop mode entry procedure is ignored and program execution continues.

Mode exit

If WFI or Return from ISR was used for entry:

All EXTI lines configured in Interrupt mode (the corresponding EXTI Interrupt vector must be enabled in the NVIC). The interrupt source can be external interrupts or peripherals with wakeup capability. Refer to Table 36: STM32F72xxx and STM32F73xxx vector table on page 257 .

If WFE was used for entry and SEVONPEND = 0:

All EXTI Lines configured in event mode. Refer to Section 10.3: Wakeup event management on page 263

If WFE was used for entry and SEVONPEND = 1:

Wakeup latencyRefer to Table 18: Stop operating modes

4.3.6 Standby mode

The Standby mode allows to achieve the lowest power consumption. It is based on the Cortex®-M7 deepsleep mode, with the voltage regulator disabled. The 1.2 V domain is consequently powered off. The PLLs, the HSI oscillator and the HSE oscillator are also switched off. SRAM and register contents are lost except for registers in the backup domain (RTC registers, RTC backup register and backup SRAM), and Standby circuitry (see Figure 5 ).

Entering Standby mode

The Standby mode is entered according to Entering low-power mode, when the SLEEPDEEP bit in the Cortex®-M7 System Control register is set.

Refer to Table 20 for more details on how to enter Standby mode.

In Standby mode, the following features can be selected by programming individual control bits:

Exiting Standby mode

The microcontroller exits Standby mode when an external Reset (NRST pin), an IWDG Reset, a rising or falling edge on WKUP pin, an RTC alarm, a tamper event, or a time stamp event is detected. All registers are reset after wakeup from Standby except for PWR power control/status register (PWR_CSR1) .

After waking up from Standby mode, program execution restarts in the same way as after a Reset (boot pin sampling, vector reset is fetched, etc.). The SBF status flag in the PWR power control/status register (PWR_CSR1) indicates that the MCU was in Standby mode.

Refer to Table 20 for more details on how to exit Standby mode.

Table 20. Standby mode entry and exit

Standby modeDescription
Mode entry

WFI (Wait for Interrupt) or WFE (Wait for Event) while:

  • – SLEEPDEEP is set in Cortex®-M7 System Control register,
  • – PDDS bit is set in Power Control register (PWR_CR1),
  • – No interrupt (for WFI) or event (for WFE) is pending,
  • – WUIF bit is cleared in Power Control and Status register (PWR_CSR1),
  • – the RTC flag corresponding to the chosen wakeup source (RTC Alarm A, RTC Alarm B, RTC wakeup, Tamper or Timestamp flags) is cleared.
  • – EIWUP bit is set in Power Control register (PWR_CSR1).

On return from ISR while:

  • – SLEEPDEEP bit is set in Cortex®-M7 System Control register, and
  • – SLEEPONEXIT = 1, and
  • – PDDS bit is set in Power Control register (PWR_CR1), and
  • – No interrupt is pending,
  • – WUIF bit is cleared in Power Control and Status register (PWR_CSR1),
  • – The RTC flag corresponding to the chosen wakeup source (RTC Alarm A, RTC Alarm B, RTC wakeup, Tamper or Timestamp flags) is cleared.
Mode exitWKUP pin rising or falling edge, RTC alarm (Alarm A and Alarm B), RTC wakeup, tamper event, time stamp event, external reset in NRST pin, IWDG reset.
Wakeup latencyReset phase.

I/O states in Standby mode

In Standby mode, all I/O pins are high impedance except for:

4.3.7 Programming the RTC alternate functions to wake up the device from the Stop and Standby modes

The MCU can be woken up from a low-power mode by an RTC alternate function.

The RTC alternate functions are the RTC alarms (Alarm A and Alarm B), RTC wakeup, RTC tamper event detection and RTC time stamp event detection.

These RTC alternate functions can wake up the system from the Stop and Standby low-power modes.

The system can also wake up from low-power modes without depending on an external interrupt (Auto-wakeup mode), by using the RTC alarm or the RTC wakeup events.

The RTC provides a programmable time base for waking up from the Stop or Standby mode at regular intervals.

For this purpose, two of the three alternate RTC clock sources can be selected by programming the RTCSEL[1:0] bits in the RCC backup domain control register (RCC_BDCR) :

RTC alternate functions to wake up the device from the Stop mode

RTC alternate functions to wake up the device from the Standby mode

Safe RTC alternate function wakeup flag clearing sequence

To avoid bouncing on the pins onto which the RTC alternate functions are mapped, and exit correctly from the Stop and Standby modes, it is recommended to follow the sequence below before entering the Standby mode:

4.4 Power control registers

4.4.1 PWR power control register (PWR_CR1)

Address offset: 0x00

Reset value: 0x0000 C000 (reset by wakeup from Standby mode)

31302928272625242322212019181716
Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.UDEN[1:0]ODSWENODEN
rwrwrwrw

1514131211109876543210
VOS[1:0]ADCDC1Res.MRUDSLPUDSFPDSDBPPLS[2:0]PVDECSBFRes.PDDSLPDS
rwrwrwrwrwrwrwrwrwrwrwrc_w1rwrw

Bits 31:20 Reserved, must be kept at reset value.

Bits 19:18 UDEN[1:0] : Under-drive enable in stop mode

These bits are set by software. They allow to achieve a lower power consumption in Stop mode but with a longer wakeup time.

When set, the digital area has less leakage consumption when the device enters Stop mode.

Bit 17 ODSWEN : Over-drive switching enabled.

This bit is set by software. It is cleared automatically by hardware after exiting from Stop mode or when the ODEN bit is reset. When set, It is used to switch to Over-drive mode.

To set or reset the ODSWEN bit, the HSI or HSE must be selected as system clock.

The ODSWEN bit must only be set when the ODRDY flag is set to switch to Over-drive mode.

Note: On any over-drive switch (enabled or disabled), the system clock will be stalled during the internal voltage set up.

Bit 16 ODEN : Over-drive enable

This bit is set by software. It is cleared automatically by hardware after exiting from Stop mode. It is used to enabled the Over-drive mode in order to reach a higher frequency.

To set or reset the ODEN bit, the HSI or HSE must be selected as system clock. When the ODEN bit is set, the application must first wait for the Over-drive ready flag (ODRDY) to be set before setting the ODSWEN bit.

Bits 15:14 VOS[1:0] : Regulator voltage scaling output selection

These bits control the main internal voltage regulator output voltage to achieve a trade-off between performance and power consumption when the device does not operate at the maximum frequency (refer to the STM32F72xxx and STM32F73xxx datasheets for more details).

These bits can be modified only when the PLL is OFF. The new value programmed is active only when the PLL is ON. When the PLL is OFF, the voltage scale 3 is automatically selected.

00: Reserved (Scale 3 mode selected)

01: Scale 3 mode

10: Scale 2 mode

11: Scale 1 mode (reset value)

Bit 13 ADCD1 :

0: No effect.

1: Refer to AN4073 for details on how to use this bit.

Note: This bit can only be set when operating at supply voltage range 2.7 to 3.6V.

Bit 12 Reserved, must be kept at reset value.

Bit 11 MRUDS : Main regulator in deepsleep under-drive mode

This bit is set and cleared by software.

0: Main regulator ON when the device is in Stop mode

1: Main Regulator in under-drive mode and Flash memory in power-down when the device is in Stop under-drive mode.

Bit 10 LPUDS : Low-power regulator in deepsleep under-drive mode

This bit is set and cleared by software.

0: Low-power regulator ON if LPDS bit is set when the device is in Stop mode

1: Low-power regulator in under-drive mode if LPDS bit is set and Flash memory in power-down when the device is in Stop under-drive mode.

Bit 9 FPDS : Flash power-down in Stop mode

When set, the Flash memory enters power-down mode when the device enters Stop mode. This allows to achieve a lower consumption in stop mode but a longer restart time.

0: Flash memory not in power-down when the device is in Stop mode

1: Flash memory in power-down when the device is in Stop mode

Bit 8 DBP : Disable backup domain write protection

In reset state, the RCC_BDCR register, the RTC registers (including the backup registers), and the BRE bit of the PWR_CSR1 register, are protected against parasitic write access. This bit must be set to enable write access to these registers.

0: Access to RTC and RTC Backup registers and backup SRAM disabled

1: Access to RTC and RTC Backup registers and backup SRAM enabled

Bits 7:5 PLS[2:0] : PVD level selection

These bits are written by software to select the voltage threshold detected by the programmable voltage detector

Note: Refer to the electrical characteristics of the datasheet for more details.

Bit 4 PVDE : Programmable voltage detector enable

This bit is set and cleared by software.

Bit 3 CSBF : Clear standby flag

This bit is always read as 0.

Bit 2 Reserved, must be kept at reset value

Bit 1 PDDS : Power-down deepsleep

This bit is set and cleared by software. It works together with the LPDS bit.

Bit 0 LPDS : Low-power deepsleep

This bit is set and cleared by software. It works together with the PDDS bit.

4.4.2 PWR power control/status register (PWR_CSR1)

Address offset: 0x04

Reset value: 0x0000 0000 (not reset by wakeup from Standby mode)

Additional APB cycles are needed to read this register versus a standard APB read.

31302928272625242322212019181716
Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.UDRDY[1:0]ODSWRDYODRDY
rc_w1rc_w1rr
1514131211109876543210
Res.VOS RDYRes.Res.Res.Res.BREEIWUPRes.Res.Res.Res.BRRPVDOSBFWUIF
rrwrwrrrr

Bits 31:20 Reserved, must be kept at reset value.

Bits 19:18 UDRDY[1:0] : Under-drive ready flag

These bits are set by hardware when MCU enters stop Under-drive mode and exits. When the Under-drive mode is enabled, these bits are not set as long as the MCU has not entered stop mode yet. they are cleared by programming them to 1.

00: Under-drive is disabled

01: Reserved

10: Reserved

11:Under-drive mode is activated in Stop mode.

Bit 17 ODSWRDY : Over-drive mode switching ready

0: Over-drive mode is not active.

1: Over-drive mode is active on digital area on 1.2 V domain

Bit 16 ODRDY : Over-drive mode ready

0: Over-drive mode not ready.

1: Over-drive mode ready

Bit 14 VOSRDY : Regulator voltage scaling output selection ready bit

0: Not ready

1: Ready

Bits 13:10 Reserved, must be kept at reset value.

Bit 9 BRE : Backup regulator enable

When set, the Backup regulator (used to maintain backup SRAM content in Standby and \( V_{BAT} \) modes) is enabled. If BRE is reset, the backup regulator is switched off. The backup SRAM can still be used but its content will be lost in the Standby and \( V_{BAT} \) modes. Once set, the application must wait that the Backup Regulator Ready flag (BRR) is set to indicate that the data written into the RAM will be maintained in the Standby and \( V_{BAT} \) modes.

0: Backup regulator disabled

1: Backup regulator enabled

Note: This bit is not reset when the device wakes up from Standby mode or by a system reset or by a power reset. It is reset by a backup domain reset.

The DBP bit of PWR_CR register must be set to 1 before PWR_CSR.BRE can be written.

Bit 8 EIWUP : Enable internal wakeup

This bit must be set when RTC events (Alarm A or Alarm B, RTC Tamper, RTC TimeStamp or RTC Wakeup time) are used to wake up the system from Standby mode.

This bit is always read as 0.

0: Disable internal wakeup sources (RTC events) during Standby mode

1: Enable internal wakeup sources (RTC events) during Standby mode

Bits 7:4 Reserved, must be kept at reset value.

Bit 3 BRR : Backup regulator ready

Set by hardware to indicate that the Backup Regulator is ready.

0: Backup Regulator not ready

1: Backup Regulator ready

Note: This bit is not reset when the device wakes up from Standby mode or by a system reset or power reset. It is reset by a backup domain reset.

Bit 2 PVDO : PVD output

This bit is set and cleared by hardware. It is valid only if PVD is enabled by the PVDE bit.

0: \( V_{DD} \) is higher than the PVD threshold selected with the PLS[2:0] bits.

1: \( V_{DD} \) is lower than the PVD threshold selected with the PLS[2:0] bits.

Note: The PVD is stopped by Standby mode. For this reason, this bit is equal to 0 after Standby or reset until the PVDE bit is set.

Bit 1 SBF : Standby flag

This bit is set by hardware and cleared only by a POR/PDR (power-on reset/power-down reset) or by setting the CSBF bit in the PWR power control register (PWR_CR1)

0: Device has not been in Standby mode

1: Device has been in Standby mode

Bit 0 WUIF : Wakeup internal flag

This bit is set when a wakeup is detected on the internal wakeup line in standby mode. It is cleared when all internal wakeup sources are cleared.

0: No wakeup internal event occurred

1: A wakeup event was detected from the RTC alarm (Alarm A or Alarm B), RTC Tamper event, RTC TimeStamp event or RTC Wakeup

4.4.3 PWR power control/status register 2 (PWR_CR2)

Address offset: 0x08

Reset value: 0x0000 0000 (not reset by wakeup from Standby mode)

31302928272625242322212019181716
Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.
1514131211109876543210
Res.Res.WUPP6WUPP5WUPP4WUPP3WUPP2WUPP1Res.Res.CWUPF6CWUPF5CWUPF4CWUPF3CWUPF2CWUPF1
rwrwrwrwrwrwrrrrrr

Bits 31:14 Reserved, always read as 0.

Bit 13 WUPP6 : Wakeup pin polarity bit for PI11

These bits define the polarity used for event detection on external wake-up pin PI11.

0: Detection on rising edge

1: Detection on falling edge

Bit 12 WUPP5 : Wakeup pin polarity bit for PI8

These bits define the polarity used for event detection on external wake-up pin PI8.

0: Detection on rising edge

1: Detection on falling edge

Bit 11 WUPP4 : Wakeup pin polarity bit for PC13

These bits define the polarity used for event detection on external wake-up pin PC13.

0: Detection on rising edge

1: Detection on falling edge

Bit 10 WUPP3 : Wakeup pin polarity bit for PC1

These bits define the polarity used for event detection on external wake-up pin PC1.

0: Detection on rising edge

1: Detection on falling edge

Bit 9 WUPP2 : Wakeup pin polarity bit for PA2

These bits define the polarity used for event detection on external wake-up pin PA2.

0: Detection on rising edge

1: Detection on falling edge

Bit 8 WUPP1 : Wakeup pin polarity bit for PA0

These bits define the polarity used for event detection on external wake-up pin PA0.

0: Detection on rising edge

1: Detection on falling edge

Bits 7:6 Reserved, always read as 0

Bit 5 CWUPF6 : Clear Wakeup Pin flag for PI11

These bits are always read as 0

0: No effect

1: Clear the WUPF Wakeup Pin flag after 2 System clock cycles.

Bit 4 CWUPF5 : Clear Wakeup Pin flag for PI8

These bits are always read as 0

0: No effect

1: Clear the WUPF Wakeup Pin flag after 2 System clock cycles.

Bit 3 CWUPF4 : Clear Wakeup Pin flag for PC13

These bits are always read as 0

0: No effect

1: Clear the WUPF Wakeup Pin flag after 2 System clock cycles.

Bit 2 CWUPF3 : Clear Wakeup Pin flag for PC1

These bits are always read as 0

0: No effect

1: Clear the WUPF Wakeup Pin flag after 2 System clock cycles.

Bit 1 CWUPF2 : Clear Wakeup Pin flag for PA2

These bits are always read as 0

0: No effect

1: Clear the WUPF Wakeup Pin flag after 2 System clock cycles.

Bit 0 CWUPF1 : Clear Wakeup Pin flag for PA0

These bits are always read as 0

0: No effect

1: Clear the WUPF Wakeup Pin flag after 2 System clock cycles.

4.4.4 PWR power control register 2 (PWR_CSR2)

Address offset: 0x0C

Reset value: 0x0000 0000 (reset by wakeup from Standby mode, except wakeup flags which are reset by RESET pin)

Additional APB cycles are needed to read this register versus a standard APB read.

31302928272625242322212019181716
Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.
1514131211109876543210
Res.Res.EWUP6EWUP5EWUP4EWUP3EWUP2EWUP1Res.Res.WUPF6WUPF5WUPF4WUPF3WUPF2WUPF1
rwrwrwrwrwrwrrrrrr

Bits 31:14 Reserved, always read as 0.

Bits 13 EWUP6 : Enable Wakeup pin for PI11

This bit is set and cleared by software.

0: An event on WKUP pin PI11 does not wake-up the device from Standby mode.

1: A rising or falling edge on WKUP pin PI11 wakes-up the system from Standby mode.

Bit 12 EWUP5 : Enable Wakeup pin for PI8

This bit is set and cleared by software.

0: An event on WKUP pin PI8 does not wake-up the device from Standby mode.

1: A rising or falling edge on WKUP pin PI8 wakes-up the system from Standby mode.

Bit 11 EWUP4 : Enable Wakeup pin for PC13

This bit is set and cleared by software.

0: An event on WKUP pin PC13 does not wake-up the device from Standby mode.

1: A rising or falling edge on WKUP pin PC13 wakes-up the system from Standby mode.

Bit 10 EWUP3 : Enable Wakeup pin for PC1

This bit is set and cleared by software.

0: An event on WKUP pin PC1 does not wake-up the device from Standby mode.

1: A rising or falling edge on WKUP pin PC1 wakes-up the system from Standby mode.

Bit 9 EWUP2 : Enable Wakeup pin for PA2

This bit is set and cleared by software.

0: An event on WKUP pin PA2 does not wake-up the device from Standby mode.

1: A rising or falling edge on WKUP pin PA2 wakes-up the system from Standby mode.

Bit 8 EWUP1 : Enable Wakeup pin for PA0

This bit is set and cleared by software.

0: An event on WKUP pin PA0 does not wake-up the device from Standby mode.

1: A rising or falling edge on WKUP pin PA0 wakes-up the system from Standby mode.

Bits 7:6 Reserved, always read as 0

Bit 5 WUPF6: Wakeup Pin flag for PI11

This bit is set by hardware and cleared only by a Reset pin or by setting the CWUPF6 bit in the PWR power control register 2 (PWR_CR2).

0: No Wakeup event occurred

1: A wakeup event is detected on WKUP PI11

Note: An additional wakeup event is detected if WKUP pin is enabled (by setting the EWUP6 bit) when WKUP pin PI11 level is already high.

Bit 4 WUPF5: Wakeup Pin flag for PI8

This bit is set by hardware and cleared only by a Reset pin or by setting the CWUPF5 bit in the PWR power control register 2 (PWR_CR2).

0: No Wakeup event occurred

1: A wakeup event is detected on WKUP PI8

Note: An additional wakeup event is detected if WKUP pin is enabled (by setting the EWUP5 bit) when WKUP pin PI8 level is already high.

Bit 3 WUPF4: Wakeup Pin flag for PC13

This bit is set by hardware and cleared only by a Reset pin or by setting the CWUPF4 bit in the PWR power control register 2 (PWR_CR2).

0: No Wakeup event occurred

1: A wakeup event is detected on WKUP PC13

Note: An additional wakeup event is detected if WKUP pin is enabled (by setting the EWUP4 bit) when WKUP pin PC13 level is already high.

Bit 2 WUPF3: Wakeup Pin flag for PC1

This bit is set by hardware and cleared only by a Reset pin or by setting the CWUPF3 bit in the PWR power control register 2 (PWR_CR2).

0: No Wakeup event occurred

1: A wakeup event is detected on WKUP PC1

Note: An additional wakeup event is detected if WKUP pin is enabled (by setting the EWUP3 bit) when WKUP pin PC1 level is already high.

Bit 1 WUPF2: Wakeup Pin flag for PA2

This bit is set by hardware and cleared only by a Reset pin or by setting the CWUPF2 bit in the PWR power control register 2 (PWR_CR2).

0: No Wakeup event occurred

1: A wakeup event is detected on WKUP PA2

Note: An additional wakeup event is detected if WKUP pin is enabled (by setting the EWUP2 bit) when WKUP pin PA2 level is already high.

Bit 0 WUPF1: Wakeup Pin flag for PA0

This bit is set by hardware and cleared only by a Reset pin or by setting the CWUPF1 bit in the PWR power control register 2 (PWR_CR2).

0: No Wakeup event occurred

1: A wakeup event is detected on WKUP PA0

Note: An additional wakeup event is detected if WKUP pin is enabled (by setting the EWUP1 bit) when WKUP pin PA0 level is already high.

4.5 PWR register map

The following table summarizes the PWR registers.

Table 21. PWR - register map and reset values

OffsetRegister313029282726252423222120191817161514131211109876543210
0x000PWR_CR1Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.UDEN[1:0]ODSWENODENVOS[1:0]ADDCDC1Res.MRUDSLPUDSFPDSDBPPLS[2:0]PVDECSBFRes.PDDSLPDS
Reset value1111011000000000000
0x004PWR_CSR1Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.UDRDY[1:0]ODSWRDYODRDYRes.VOSRDYRes.Res.Res.BREEIWUPRes.Res.Res.Res.Res.BRRPVDOSBFWUIF
Reset value00000000000
0x008PWR_CR2Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.EWUPF6EWUPF5EWUPF4EWUPF3EWUPF2EWUPF1Res.Res.CWUPF6CWUPF5CWUPF4CWUPF3CWUPF2CWUPF1
Reset value0000000000000
0x00CPWR_CSR2Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.EWUPF6EWUPF5EWUPF4EWUPF3EWUPF2EWUPF1Res.Res.CWUPF6CWUPF5CWUPF4CWUPF3CWUPF2CWUPF1
Reset value0000000000000

Refer to Section 1.6 on page 56 for the register boundary addresses.