4. Power controller (PWR)

4.1 Power supplies

The device requires a 1.8 to 3.6 V operating voltage supply ( \( V_{DD} \) ). An embedded linear voltage regulator is used to supply the internal 1.2 V digital power.

The real-time clock (RTC), the RTC backup registers, and the backup SRAM (BKP SRAM) can be powered from the \( V_{BAT} \) voltage when the main \( V_{DD} \) supply is powered off.

Note: Depending on the operating power supply range, some peripheral may be used with limited functionality and performance. For more details refer to section "General operating conditions" in STM32F75xxx and STM32F74xxx datasheets.

Figure 5. Power supply overview

Figure 5. Power supply overview. This block diagram illustrates the power distribution and regulation for the microcontroller. At the top, a battery (VBAT = 1.65 to 3.6V) is connected to a 'Power switch'. The output of the switch feeds into 'Backup circuitry' (OSC32K, RTC, Wakeup logic, Backup registers, backup RAM) and a 'Level shifter'. The 'Level shifter' connects to 'GP I/Os' and 'IO Logic'. Below the level shifter, a 'Voltage regulator' is shown. It has input pins labeled VCAP_1 and VCAP_2, with a capacitor configuration of '2 x 2.2 µF'. The regulator has output pins labeled VDD and VSS, with a capacitor configuration of '19 x 100 nF + 1 x 4.7 µF'. The VDD output feeds into 'Kernel logic (CPU, digital & RAM)' and 'Flash memory'. A 'BYPASS_REG' pin on the regulator is connected to VDDUSB, which has its own capacitor configuration of '100 nF + 1 µF'. The VDDUSB line also connects to an 'OTG FS PHY'. Below the PHY is a 'Reset controller' connected to the PDR_ON pin. At the bottom, an 'ADC' block is shown. It has pins for VDDA, VREF+, VREF-, and VSSA. The VDDA pin is connected to a VDD source with a capacitor configuration of '100 nF + 1 µF'. The VREF+ pin is connected to a VREF source with a capacitor configuration of '100 nF + 1 µF'. The VSSA pin is connected to a VSS source with a capacitor configuration of '100 nF + 1 µF'. The ADC is also connected to 'Analog: RCs, PLL, ...'. A dashed box encloses the 'Kernel logic', 'Flash memory', and 'ADC' blocks. The diagram is labeled MSv35942V1 in the bottom right corner.
Figure 5. Power supply overview. This block diagram illustrates the power distribution and regulation for the microcontroller. At the top, a battery (VBAT = 1.65 to 3.6V) is connected to a 'Power switch'. The output of the switch feeds into 'Backup circuitry' (OSC32K, RTC, Wakeup logic, Backup registers, backup RAM) and a 'Level shifter'. The 'Level shifter' connects to 'GP I/Os' and 'IO Logic'. Below the level shifter, a 'Voltage regulator' is shown. It has input pins labeled VCAP_1 and VCAP_2, with a capacitor configuration of '2 x 2.2 µF'. The regulator has output pins labeled VDD and VSS, with a capacitor configuration of '19 x 100 nF + 1 x 4.7 µF'. The VDD output feeds into 'Kernel logic (CPU, digital & RAM)' and 'Flash memory'. A 'BYPASS_REG' pin on the regulator is connected to VDDUSB, which has its own capacitor configuration of '100 nF + 1 µF'. The VDDUSB line also connects to an 'OTG FS PHY'. Below the PHY is a 'Reset controller' connected to the PDR_ON pin. At the bottom, an 'ADC' block is shown. It has pins for VDDA, VREF+, VREF-, and VSSA. The VDDA pin is connected to a VDD source with a capacitor configuration of '100 nF + 1 µF'. The VREF+ pin is connected to a VREF source with a capacitor configuration of '100 nF + 1 µF'. The VSSA pin is connected to a VSS source with a capacitor configuration of '100 nF + 1 µF'. The ADC is also connected to 'Analog: RCs, PLL, ...'. A dashed box encloses the 'Kernel logic', 'Flash memory', and 'ADC' blocks. The diagram is labeled MSv35942V1 in the bottom right corner.
  1. 1. \( V_{DDA} \) and \( V_{SSA} \) must be connected to \( V_{DD} \) and \( V_{SS} \) , respectively.

4.1.1 Independent A/D converter supply and reference voltage

To improve conversion accuracy, the ADC has an independent power supply which can be separately filtered and shielded from noise on the PCB.

To ensure a better accuracy of low voltage inputs, the user can connect a separate external reference voltage ADC input on \( V_{REF} \) . The voltage on \( V_{REF} \) ranges from 1.8 V to \( V_{DDA} \) .

4.1.2 Independent USB transceivers supply

The \( V_{DDUSB} \) is an independent USB power supply for full speed transceivers (USB OTG FS and USB OTG HS in FS mode). It can be connected either to \( V_{DD} \) or an external independent power supply (3.0 to 3.6V) for USB transceivers (refer Figure 6 and Figure 7 ). For example, when the device is powered at 1.8V, an independent power supply 3.3V can be connected to \( V_{DDUSB} \) . When the \( V_{DDUSB} \) is connected to a separated power supply, it is independent from \( V_{DD} \) or \( V_{DDA} \) but it must be the last supply to be provided and the first to disappear. The following conditions \( V_{DDUSB} \) must be respected:

Figure 6. \( V_{DDUSB} \) connected to \( V_{DD} \) power supply

Figure 6: Graph showing VDD, VDD_MAX, VDD_MIN, and VDDUSB over time. The graph illustrates the relationship between VDD and VDDUSB during power-on, operating mode, and power-down phases. VDD rises from 0 to VDD_MAX, stays constant, and then falls back to 0. VDDUSB follows VDD during power-on and power-down, but is constant at VDD_MAX during operating mode. The operating mode is defined as the period where VDD is between VDD_MIN and VDD_MAX.

The diagram is a plot of voltage versus time. The vertical axis is labeled VDD. Two horizontal dotted lines represent \( V_{DD\_MAX} \) (top) and \( V_{DD\_MIN} \) (bottom). The horizontal axis is labeled 'time'. The plot shows a trapezoidal voltage curve.
1. Power-on phase : The voltage rises linearly from zero. A vertical dashed line marks the point where the voltage crosses \( V_{DD\_MIN} \) .
2. Operating mode : The voltage reaches a plateau labeled \( V_{DD} = V_{DDA} = V_{DDUSB} \) . This plateau is at the \( V_{DD\_MAX} \) level.
3. Power-down phase : After a second vertical dashed line, the voltage falls linearly back to zero.
The region between the two vertical dashed lines, where the voltage is above \( V_{DD\_MIN} \) , is labeled 'Operating mode'.

Figure 6: Graph showing VDD, VDD_MAX, VDD_MIN, and VDDUSB over time. The graph illustrates the relationship between VDD and VDDUSB during power-on, operating mode, and power-down phases. VDD rises from 0 to VDD_MAX, stays constant, and then falls back to 0. VDDUSB follows VDD during power-on and power-down, but is constant at VDD_MAX during operating mode. The operating mode is defined as the period where VDD is between VDD_MIN and VDD_MAX.

MS37591V1

Figure 7.\( V_{DDUSB} \) connected to external independent power supply Figure 7: Graph showing voltage levels over time for V_DDUSB and V_DD=V_DDA. The graph is divided into three time phases: Power-on, Operating mode, and Power-down. V_DDUSB rises to a plateau between V_DDUSB_MIN and V_DDUSB_MAX during the Operating mode, which is labeled as the 'USB functional area' (shaded light blue). Before and after this plateau, while V_DDUSB is below V_DDUSB_MIN, the regions are shaded pink and labeled 'USB non functional area'. A second line represents V_DD = V_DDA, which plateaus at a level above V_DD_MIN but below V_DDUSB_MIN.

The graph illustrates the relationship between \( V_{DDUSB} \) and \( V_{DD} = V_{DDA} \) across three phases: Power-on, Operating mode, and Power-down. The y-axis marks critical thresholds: \( V_{DDUSB\_MAX} \) , \( V_{DDUSB\_MIN} \) , and \( V_{DD\_MIN} \) . The 'USB functional area' is active when \( V_{DDUSB} \) is between its minimum and maximum limits during the Operating mode. Outside this range, the system is in the 'USB non functional area'.

Figure 7: Graph showing voltage levels over time for V_DDUSB and V_DD=V_DDA. The graph is divided into three time phases: Power-on, Operating mode, and Power-down. V_DDUSB rises to a plateau between V_DDUSB_MIN and V_DDUSB_MAX during the Operating mode, which is labeled as the 'USB functional area' (shaded light blue). Before and after this plateau, while V_DDUSB is below V_DDUSB_MIN, the regions are shaded pink and labeled 'USB non functional area'. A second line represents V_DD = V_DDA, which plateaus at a level above V_DD_MIN but below V_DDUSB_MIN.

MS37590V1

4.1.3 Battery backup domain

Backup domain description

To retain the content of the RTC backup registers, backup SRAM, and supply the RTC when \( V_{DD} \) is turned off, \( V_{BAT} \) pin can be connected to an optional standby voltage supplied by a battery or by another source.

To allow the RTC to operate even when the main digital supply ( \( V_{DD} \) ) is turned off, the \( V_{BAT} \) pin powers the following blocks:

The switch to the \( V_{BAT} \) supply is controlled by the power-down reset embedded in the Reset block.

Warning: During \( t_{RSTTEMPO} \) (temporization at \( V_{DD} \) startup) or after a PDR is detected, the power switch between \( V_{BAT} \) and \( V_{DD} \) remains connected to \( V_{BAT} \) .

During the startup phase, if \( V_{DD} \) is established in less than \( t_{RSTTEMPO} \) (Refer to the datasheet for the value of \( t_{RSTTEMPO} \) ) and \( V_{DD} > V_{BAT} + 0.6 \) V, a current may be injected into \( V_{BAT} \) through an internal diode connected between \( V_{DD} \) and the power switch ( \( V_{BAT} \) ).

If the power supply/battery connected to the \( V_{BAT} \) pin cannot support this current injection, it is strongly recommended to

connect an external low-drop diode between this power supply and the \( V_{BAT} \) pin.

If no external battery is used in the application, it is recommended to connect the \( V_{BAT} \) externally to \( V_{DD} \) through a 100 nF external ceramic capacitor.

When the backup domain is supplied by \( V_{DD} \) (analog switch connected to \( V_{DD} \) ), the following functions are available:

Note: Due to the fact that the switch only sinks a limited amount of current (3 mA), the use of GPIOs PI8 and PC13 to PC15 are restricted: the speed has to be limited to 2 MHz with a maximum load of 30 pF and these I/Os must not be used as a current source (e.g. to drive an LED).

When the backup domain is supplied by \( V_{BAT} \) (analog switch connected to \( V_{BAT} \) because \( V_{DD} \) is not present), the following functions are available:

Backup domain access

After reset, the backup domain (RTC registers, RTC backup register and backup SRAM) is protected against possible unwanted write accesses. To enable access to the backup domain, proceed as follows:

RTC and RTC backup registers

The real-time clock (RTC) is an independent BCD timer/counter. The RTC provides a time-of-day clock/calendar, two programmable alarm interrupts, and a periodic programmable wakeup flag with interrupt capability. The RTC contains 32 backup data registers (128 bytes)

which are reset when a tamper detection event occurs. For more details refer to Section 29: Real-time clock (RTC) .

Backup SRAM

The backup domain includes 4 Kbytes of backup SRAM addressed in 32-bit, 16-bit or 8-bit mode. Its content is retained even in Standby or \( V_{BAT} \) mode when the low-power backup regulator is enabled. It can be considered as an internal EEPROM when \( V_{BAT} \) is always present.

When the backup domain is supplied by \( V_{DD} \) (analog switch connected to \( V_{DD} \) ), the backup SRAM is powered from \( V_{DD} \) which replaces the \( V_{BAT} \) power supply to save battery life.

When the backup domain is supplied by \( V_{BAT} \) (analog switch connected to \( V_{BAT} \) because \( V_{DD} \) is not present), the backup SRAM is powered by a dedicated low-power regulator. This regulator can be ON or OFF depending whether the application needs the backup SRAM function in Standby and \( V_{BAT} \) modes or not. The power-down of this regulator is controlled by a dedicated bit, the BRE control bit of the PWR_CSR1 register (see Section 4.4.2: PWR power control/status register (PWR_CSR1) ).

The backup SRAM is not mass erased by a tamper event. It is read protected to prevent confidential data, such as cryptographic private key, from being accessed. The backup SRAM can be erased only through the Flash interface when a protection level change from level 1 to level 0 is requested. Refer to the description of Read protection (RDP) option byte.

Figure 8. Backup domain

Figure 8. Backup domain diagram showing the internal components and power supply logic.

The diagram illustrates the internal architecture of the backup domain. On the left, a 'Voltage regulator 3.3 -> 1.2 V' is shown, which connects to a '1.2 V domain' box. Inside this box is a 'Backup SRAM interface'. To the right, a 'Power switch' is depicted as a switch that can connect the 'LP voltage regulator 3.3 -> 1.2 V' to the 'Backup SRAM 1.2 V' or to the 'RTC'. The 'Backup SRAM 1.2 V' and 'RTC' are both connected to the 'Backup SRAM interface'. The 'RTC' is further connected to an 'LSE 32.768 Hz' oscillator. The entire right-side assembly, including the Power switch, LP voltage regulator, Backup SRAM, RTC, and LSE, is enclosed in a 'Backup domain' box. A reference code 'MS30430V1' is located in the bottom right corner of the diagram area.

Figure 8. Backup domain diagram showing the internal components and power supply logic.

4.1.4 Voltage regulator

An embedded linear voltage regulator supplies all the digital circuitries except for the backup domain and the Standby circuitry. The regulator output voltage is around 1.2 V.

This voltage regulator requires two external capacitors to be connected to two dedicated pins, \( V_{CAP\_1} \) and \( V_{CAP\_2} \) available in all packages. Specific pins must be connected either to \( V_{SS} \) or \( V_{DD} \) to activate or deactivate the voltage regulator. These pins depend on the package.

When activated by software, the voltage regulator is always enabled after Reset. It works in three different modes depending on the application modes (Run, Stop, or Standby mode).

The voltage scaling allows optimizing the power consumption when the device is clocked below the maximum system frequency. After exit from Stop mode, the voltage scale 3 is automatically selected.(see Section 4.4.1: PWR power control register (PWR_CR1) ).

2 operating modes are available:

The voltage regulator can be put either in main regulator mode (MR) or in low-power mode (LPR). Both modes can be configured by software as follows:

Note: Over-drive and under-drive mode are not available when the regulator is bypassed.

For more details, refer to the voltage regulator section in the datasheets.

Table 12. Voltage regulator configuration mode versus device operating mode (1)

Voltage regulator configurationRun modeSleep modeStop modeStandby mode
Normal modeMRMRMR or LPR-
Over-drive mode (2)MRMR--
Under-drive mode--MR or LPR-
Power-down mode---Yes

1. '-' means that the corresponding configuration is not available.

2. The over-drive mode is not available when \( V_{DD} = 1.8 \) to \( 2.1 \) V.

Entering Over-drive mode

It is recommended to enter Over-drive mode when the application is not running critical tasks and when the system clock source is either HSI or HSE. To optimize the configuration time, enable the Over-drive mode during the PLL lock phase.

To enter Over-drive mode, follow the sequence below:

  1. 1. Select HSI or HSE as system clock.
  2. 2. Configure RCC_PLLCFGR register and set PLLON bit of RCC_CR register.
  3. 3. Set ODEN bit of PWR_CR1 register to enable the Over-drive mode and wait for the ODRDY flag to be set in the PWR_CSR1 register.
  4. 4. Set the ODSW bit in the PWR_CR1 register to switch the voltage regulator from Normal mode to Over-drive mode. The System will be stalled during the switch but the PLL clock system will be still running during locking phase.
  5. 5. Wait for the ODSWRDY flag in the PWR_CSR1 to be set.
  6. 6. Select the required Flash latency as well as AHB and APB prescalers.
  7. 7. Wait for PLL lock.
  8. 8. Switch the system clock to the PLL.
  9. 9. Enable the peripherals that are not generated by the System PLL (I2S clock, LCD-TFT clock, SAI1 clock, USB_48MHz clock....).

Note: The PLLI2S and PLLSAI can be configured at the same time as the system PLL.

During the Over-drive switch activation, no peripheral clocks should be enabled. The peripheral clocks must be enabled once the Over-drive mode is activated.

Entering Stop mode disables the Over-drive mode, as well as the PLL. The application software has to configure again the Over-drive mode and the PLL after exiting from Stop mode.

Exiting from Over-drive mode

It is recommended to exit from Over-drive mode when the application is not running critical tasks and when the system clock source is either HSI or HSE. There are two sequences that allow exiting from over-drive mode:

Example of sequence 1:

  1. 1. Select HSI or HSE as system clock source.
  2. 2. Disable the peripheral clocks that are not generated by the System PLL (I2S clock, LCD-TFT clock, SAI1 clock, USB_48MHz clock,...)
  3. 3. Reset simultaneously the ODEN and the ODSW bits in the PWR_CR1 register to switch back the voltage regulator to Normal mode and disable the Over-drive mode.
  4. 4. Wait for the ODWRDY flag of PWR_CSR1 to be reset.

Example of sequence 2:

  1. 1. Select HSI or HSE as system clock source.
  2. 2. Disable the peripheral clocks that are not generated by the System PLL (I2S clock, LCD-TFT clock, SAI1 clock, USB_48MHz clock,...).
  3. 3. Reset the ODSW bit in the PWR_CR1 register to switch back the voltage regulator to Normal mode. The system clock is stalled during voltage switching.
  4. 4. Wait for the ODWREADY flag of PWR_CSR1 to be reset.
  5. 5. Reset the ODEN bit in the PWR_CR1 register to disable the Over-drive mode.

Note: During step 3, the ODEN bit remains set and the Over-drive mode is still enabled but not active (ODSW bit is reset). If the ODEN bit is reset instead, the Over-drive mode is disabled and the voltage regulator is switched back to the initial voltage.

4.2 Power supply supervisor

4.2.1 Power-on reset (POR)/power-down reset (PDR)

The device has an integrated POR/PDR circuitry that allows proper operation starting from 1.8 V.

The device remains in Reset mode when \( V_{DD}/V_{DDA} \) is below a specified threshold, \( V_{POR/PDR} \) , without the need for an external reset circuit. For more details concerning the power on/power-down reset threshold, refer to the electrical characteristics of the datasheet.

Figure 9. Power-on reset/power-down reset waveform

Figure 9. Power-on reset/power-down reset waveform. The graph shows the relationship between VDD/VDDA voltage and the Reset signal. The top part shows the voltage rising from 0V to a peak and then falling. The bottom part shows the Reset signal going high when the voltage falls below the PDR threshold. The PDR threshold is shown as a dashed line. The hysteresis is indicated as 40 mV. The temporization tRSTTEMPO is shown as the time interval between the voltage falling below the PDR threshold and the Reset signal going high.

The figure is a timing diagram showing the relationship between the supply voltage \( V_{DD}/V_{DDA} \) and the Reset signal. The top graph plots \( V_{DD}/V_{DDA} \) against time, showing a rising edge, a plateau, and a falling edge. The bottom graph plots the Reset signal against time, showing a high level when the voltage is below the PDR threshold. The PDR threshold is indicated by a dashed line. The hysteresis is shown as a 40 mV difference between the rising and falling thresholds. The temporization \( t_{RSTTEMPO} \) is indicated as the time interval between the voltage falling below the PDR threshold and the Reset signal going high.

Figure 9. Power-on reset/power-down reset waveform. The graph shows the relationship between VDD/VDDA voltage and the Reset signal. The top part shows the voltage rising from 0V to a peak and then falling. The bottom part shows the Reset signal going high when the voltage falls below the PDR threshold. The PDR threshold is shown as a dashed line. The hysteresis is indicated as 40 mV. The temporization tRSTTEMPO is shown as the time interval between the voltage falling below the PDR threshold and the Reset signal going high.

4.2.2 Brownout reset (BOR)

During power on, the Brownout reset (BOR) keeps the device under reset until the supply voltage reaches the specified \( V_{BOR} \) threshold.

\( V_{BOR} \) is configured through device option bytes. By default, BOR is off. 3 programmable \( V_{BOR} \) threshold levels can be selected:

Note: For full details about BOR characteristics, refer to the "Electrical characteristics" section in the device datasheet.

When the supply voltage ( \( V_{DD} \) ) drops below the selected \( V_{BOR} \) threshold, a device reset is generated.

The BOR can be disabled by programming the device option bytes. In this case, the power-on and power-down is then monitored by the POR/ PDR (see Section 4.2.1: Power-on reset (POR)/power-down reset (PDR) ).

The BOR threshold hysteresis is \( \sim 100 \) mV (between the rising and the falling edge of the supply voltage).

Figure 10. BOR thresholds

Figure 10: BOR thresholds. A graph showing the supply voltage (VDD/VDDA) over time. The voltage rises from 0V to a peak and then falls. A horizontal dashed line represents the BOR threshold. The rising edge of the voltage crosses this threshold at a point marked by a vertical dashed line. The falling edge crosses the threshold at a point marked by another vertical dashed line. The vertical distance between these two crossing points is labeled '100 mV hysteresis'. Below the graph, a 'Reset' signal is shown as a horizontal line that goes low (active) when the voltage falls below the BOR threshold and returns high when the voltage rises back above the threshold. The diagram is labeled MS30433V1 in the bottom right corner.
Figure 10: BOR thresholds. A graph showing the supply voltage (VDD/VDDA) over time. The voltage rises from 0V to a peak and then falls. A horizontal dashed line represents the BOR threshold. The rising edge of the voltage crosses this threshold at a point marked by a vertical dashed line. The falling edge crosses the threshold at a point marked by another vertical dashed line. The vertical distance between these two crossing points is labeled '100 mV hysteresis'. Below the graph, a 'Reset' signal is shown as a horizontal line that goes low (active) when the voltage falls below the BOR threshold and returns high when the voltage rises back above the threshold. The diagram is labeled MS30433V1 in the bottom right corner.

4.2.3 Programmable voltage detector (PVD)

The user can use the PVD to monitor the \( V_{DD} \) power supply by comparing it to a threshold selected by the PLS[2:0] bits in the PWR power control register (PWR_CR1) .

The PVD is enabled by setting the PVDE bit.

A PVDO flag is available, in the PWR power control/status register (PWR_CSR1) , to indicate if \( V_{DD} \) is higher or lower than the PVD threshold. This event is internally connected

to the EXTI line16 and can generate an interrupt if enabled through the EXTI registers. The PVD output interrupt can be generated when \( V_{DD} \) drops below the PVD threshold and/or when \( V_{DD} \) rises above the PVD threshold depending on EXTI line16 rising/falling edge configuration. As an example the service routine could perform emergency shutdown tasks.

Figure 11. PVD thresholds

Figure 11. PVD thresholds. A graph showing VDD (Supply Voltage) on the y-axis and time on the x-axis. The VDD signal rises to a peak and then falls. Two horizontal dashed lines represent the PVD threshold and a lower threshold. The difference between these two thresholds is labeled '100 mV hysteresis'. Below the graph, a 'PVD output' signal is shown as a rectangular pulse that goes low when VDD drops below the lower threshold and returns high when VDD rises above the upper threshold. The diagram is labeled MS30432V2 in the bottom right corner.
Figure 11. PVD thresholds. A graph showing VDD (Supply Voltage) on the y-axis and time on the x-axis. The VDD signal rises to a peak and then falls. Two horizontal dashed lines represent the PVD threshold and a lower threshold. The difference between these two thresholds is labeled '100 mV hysteresis'. Below the graph, a 'PVD output' signal is shown as a rectangular pulse that goes low when VDD drops below the lower threshold and returns high when VDD rises above the upper threshold. The diagram is labeled MS30432V2 in the bottom right corner.

4.3 Low-power modes

By default, the microcontroller is in Run mode after a system or a power-on reset. In Run mode the CPU is clocked by HCLK and the program code is executed. Several low-power modes are available to save power when the CPU does not need to be kept running, for example when waiting for an external event. It is up to the user to select the mode that gives the best compromise between low-power consumption, short startup time and available wakeup sources.

The devices feature three low-power modes:

In addition, the power consumption in Run mode can be reduced by one of the following means:

Entering low-power mode

Low-power modes are entered by the MCU by executing the WFI (Wait For Interrupt), or WFE (Wait for Event) instructions, or when the SLEEPONEXIT bit in the Cortex ® -M7 System Control register is set on Return from ISR.

Entering Low-power mode through WFI or WFE will be executed only if no interrupt is pending or no event is pending.

Exiting low-power mode

The MCU exits from Sleep and Stop modes low-power mode depending on the way the low-power mode was entered:

When SEVONPEND = 0 in the Cortex®-M7 System Control register: by enabling an interrupt in the peripheral control register and in the NVIC. When the MCU resumes from WFE, the peripheral interrupt pending bit and the NVIC peripheral IRQ channel pending bit (in the NVIC interrupt clear pending register) have to be cleared. Only NVIC interrupts with sufficient priority will wakeup and interrupt the MCU.

When SEVONPEND = 1 in the Cortex®-M7 System Control register: by enabling an interrupt in the peripheral control register and optionally in the NVIC. When the MCU resumes from WFE, the peripheral interrupt pending bit and when enabled the NVIC peripheral IRQ channel pending bit (in the NVIC interrupt clear pending register) have to be cleared. All NVIC interrupts will wakeup the MCU, even the disabled ones. Only enabled NVIC interrupts with sufficient priority will wakeup and interrupt the MCU.

This is done by configuring a EXTI line in event mode. When the CPU resumes from WFE, it is not necessary to clear the EXTI peripheral interrupt pending bit or the NVIC IRQ channel pending bit as the pending bits corresponding to the event line is not set. It may be necessary to clear the interrupt flag in the peripheral.

The MCU exits from Standby low-power mode through an external reset (NRST pin), an IWDG reset, a rising or falling on one of the enabled WKUPx pins or a RTC event occurs (see Figure 298: RTC block diagram ).

After waking up from Standby mode, program execution restarts in the same way as after a Reset (boot pin sampling, option bytes loading, reset vector is fetched, etc.).

Only enabled NVIC interrupts with sufficient priority will wakeup and interrupt the MCU.

Table 13. Low-power mode summary

Mode nameEntryWakeupEffect on 1.2 V domain clocksEffect on V DD domain clocksVoltage regulator
Sleep
(Sleep now
or Sleep-on-exit)
WFIAny interruptCPU CLK OFF
no effect on other
clocks or analog
clock sources
NoneON
WFEWakeup event

Table 13. Low-power mode summary (continued)

Mode nameEntryWakeupEffect on 1.2 V domain clocksEffect on V DD domain clocksVoltage regulator
StopSLEEPDEEP bit + WFI or WFEAny EXTI line (configured in the EXTI registers, internal and external lines)All 1.2 V domain clocks OFFHSI and HSE oscillators OFFMain regulator or Low-power regulator (depends on PWR power control register (PWR_CR1) )
StandbyPDDS bit + SLEEPDEEP bit + WFI or WFEWKUP pin rising or falling edge, RTC alarm (Alarm A or Alarm B), RTC Wakeup event, RTC tamper events, RTC time stamp event, external reset in NRST pin, IWDG resetOFF

Table 14. Features over all modes (1)

PeripheralRunSleepStopStandbyVBAT
-Wake up-Wake up
CPUY------
Flash accessYY-----
DTCM RAMYYY----
ITCM RAMYYY----
SRAM1YYY----
SRAM2YYY----
FMCOO-----
QUADSPIOO-----
Backup RegistersYYY-Y-Y
Backup RAMYYY-Y-Y
Brown-out reset (BOR)YYYYYY-
Programmable voltage detector (PVD)OOOO---
High Speed Internal (HSI)OO(2)----
High Speed External (HSE)OO-----
Low Speed Internal (LSI)OOO-O--
Low Speed External (LSE)OOO-O-O
RTCOOOOOOO
Table 14. Features over all modes (continued) (1)
PeripheralRunSleepStopStandbyVBAT
-Wake-up-Wake-up
Number of RTC tamper pins3333332
CRC calculation unitOO-----
GPIOsYYYY-6 pins2 tamper
DMAOO-----
Chrom-Art Accelerator (DMA2D)OO-----
LCD-TFTOO-----
DCMIOO-----
USARTx (x=1..8)OO-----
I2Cx (x=1,2,3,4)OO-----
SPIx (x=1..6)OO-----
SAIx (x=1,2)OO-----
SPDIFRXOO-----
ADCx (x=1,2,3)OO-----
DACx (x=1,2)OO-----
Temperature sensorOO-----
Timers (TIMx)OO-----
Low-power timer 1 (LPTIM1)OOOO---
Independent watchdog (IWDG)OOOOOO-
Window watchdog (WWDG)OO-----
Systick timerOO-----
Random number generator (RNG)OO-----
Cryptographic processor (CRYP)OO-----
Hash processor (HASH)OO-----
SDMMCOO-----
CANx ( x=1,2)OO-----
USB OTG FSOO-O---
USB OTG HSOO-O---
EthernetOO-O---
HDMI-CECOO-----
  1. 1. Legend: Y = Yes (Enable), O = Optional (Disable by default. Can be enabled by software), - = Not available. Wakeup highlighted in gray.
  2. 2. Some peripherals with wakeup from Stop capability can request HSI to be enabled. In this case, HSI is woken up by the peripheral, and only feeds the peripheral which requested it. HSI is automatically put off when the peripheral does not need it anymore.

4.3.1 Debug mode

By default, the debug connection is lost when the device enters in Stop or Standby mode while the debug features are used. This is due to the fact that the Cortex®-M7 core is no longer clocked.

However, by setting some configuration bits in the DBGMCU_CR register, the software can be debugged even when using the low-power modes extensively. For more details, refer to Section 40.16.1: Debug support for low-power modes .

4.3.2 Run mode

Slowing down system clocks

In Run mode the speed of the system clocks (SYSCLK, HCLK, PCLK1, PCLK2) can be reduced by programming the prescaler registers. These prescalers can also be used to slow down peripherals before entering Sleep mode.

For more details refer to Section 5.3.3: RCC clock configuration register (RCC_CFGR) .

Peripheral clock gating

In Run mode, the HCLKx and PCLKx for individual peripherals and memories can be stopped at any time to reduce power consumption.

To further reduce power consumption in Sleep mode the peripheral clocks can be disabled prior to executing the WFI or WFE instructions.

Peripheral clock gating is controlled by the AHB1 peripheral clock enable register (RCC_AHB1ENR), AHB2 peripheral clock enable register (RCC_AHB2ENR), AHB3 peripheral clock enable register (RCC_AHB3ENR) (see Section 5.3.10: RCC AHB1 peripheral clock register (RCC_AHB1ENR) , Section 5.3.11: RCC AHB2 peripheral clock enable register (RCC_AHB2ENR) , and Section 5.3.12: RCC AHB3 peripheral clock enable register (RCC_AHB3ENR) ).

Disabling the peripherals clocks in Sleep mode can be performed automatically by resetting the corresponding bit in RCC_AHBxLPENR and RCC_APBxLPENR registers.

4.3.3 Low-power mode

Entering low-power mode

Low-power modes are entered by the MCU executing the WFI (Wait For Interrupt), or WFE (Wait For Event) instructions, or when the SLEEPONEXIT bit in the Cortex®-M7 System Control register is set on Return from ISR.

Exiting low-power mode

From Sleep and Stop modes the MCU exits low-power mode depending on the way the mode was entered:

By enabling an interrupt in the peripheral control register and in the NVIC. When the MCU resumes from WFE, the peripheral interrupt pending bit and the NVIC peripheral IRQ channel pending bit (in the NVIC interrupt clear pending register) have to be cleared.

Only NVIC interrupts with sufficient priority will wakeup and interrupt the MCU.

By enabling an interrupt in the peripheral control register and optionally in the NVIC. When the MCU resumes from WFE, the peripheral interrupt pending bit and (when enabled) the NVIC peripheral IRQ channel pending bit (in the NVIC interrupt clear pending register) have to be cleared.

All NVIC interrupts will wakeup the MCU, even the disabled ones.

Only enabled NVIC interrupts with sufficient priority will wakeup and interrupt the MCU.

Configuring a EXTI line in event mode. When the CPU resumes from WFE, it is not necessary to clear the EXTI peripheral interrupt pending bit or the NVIC IRQ channel pending bit as the pending bits corresponding to the event line is not set. It may be necessary to clear the interrupt flag in the peripheral.

From Standby mode the MCU exits Low-power mode through an external reset (NRST pin), an IWDG reset, a rising edge on one of the enabled WKUPx pins or a RTC event (see Figure 298: RTC block diagram ).

4.3.4 Sleep mode

I/O states in Sleep mode

In Sleep mode, all I/O pins keep the same state as in Run mode.

Entering Sleep mode

The Sleep mode is entered by executing the WFI (Wait For Interrupt) or WFE (Wait for Event) instructions. Two options are available to select the Sleep mode entry mechanism, depending on the SLEEPONEXIT bit in the Cortex ® -M7 System Control register:

Refer to Table 15 and Table 16 for details on how to enter Sleep mode.

Exiting Sleep mode

If the WFI instruction is used to enter Sleep mode, any peripheral interrupt acknowledged by the nested vectored interrupt controller (NVIC) can wake up the device from Sleep mode.

If the WFE instruction is used to enter Sleep mode, the MCU exits Sleep mode as soon as an event occurs. The wakeup event can be generated either by:

This mode offers the lowest wakeup time as no time is wasted in interrupt entry/exit.

Refer to Table 15 and Table 16 for more details on how to exit Sleep mode.

Table 15. Sleep-now entry and exit

Sleep-now modeDescription
Mode entry

WFI (Wait for Interrupt) or WFE (Wait for Event) while:

  • – SLEEPDEEP = 0, and
  • – No interrupt (for WFI) or event (for WFE) is pending.

Refer to the Cortex ® -M7 System Control register.

On Return from ISR while:

  • – SLEEPDEEP = 0 and
  • – SLEEPONEXIT = 1,
  • – No interrupt is pending.

Refer to the Cortex ® -M7 System Control register.

Mode exit

If WFI or Return from ISR was used for entry:

Interrupt: Refer to Table 44: STM32F75xxx and STM32F74xxx vector table

If WFE was used for entry and SEVONPEND = 0

Wakeup event: Refer to Section 11.3: Wakeup event management

If WFE was used for entry and SEVONPEND = 1

Interrupt even when disabled in NVIC: refer to Table 44: STM32F75xxx and STM32F74xxx vector table and Wakeup event (see Section 11.3: Wakeup event management ).

Wakeup latencyNone

Table 16. Sleep-on-exit entry and exit

Sleep-on-exitDescription
Mode entryWFI (Wait for Interrupt) or WFE (Wait for Event) while:
  • – SLEEPDEEP = 0, and
  • – No interrupt (for WFI) or event (for WFE) is pending.
Refer to the Cortex®-M7 System Control register.
On Return from ISR while:
  • – SLEEPDEEP = 0, and
  • – SLEEPONEXIT = 1, and
  • – No interrupt is pending.
Refer to the Cortex®-M7 System Control register.
Mode exitInterrupt: refer to Table 44: STM32F75xxx and STM32F74xxx vector table
Wakeup latencyNone

4.3.5 Stop mode

The Stop mode is based on the Cortex®-M7 deepsleep mode combined with peripheral clock gating. The voltage regulator can be configured either in normal or low-power mode. In Stop mode, all clocks in the 1.2 V domain are stopped, the PLLs, the HSI and the HSE RC oscillators are disabled. Internal SRAM and register contents are preserved.

In Stop mode, the power consumption can be further reduced by using additional settings in the PWR_CR1 register. However this will induce an additional startup delay when waking up from Stop mode (see Table 17 ).

Table 17. Stop operating modes

Voltage Regulator ModeUDEN[1:0] bitsMRUDS bitLPUDS bitLPDS bitFPDS bitWakeup latency
Normal modeSTOP MR (Main Regulator)-0-00HSI RC startup time
STOP MR- FPD-0-01HSI RC startup time + Flash wakeup time from power-down mode
STOP LP-0010HSI RC startup time + regulator wakeup time from LP mode
STOP LP-FPD--011HSI RC startup time + Flash wakeup time from power-down mode + regulator wakeup time from LP mode

Table 17. Stop operating modes (continued)

Voltage Regulator ModeUDEN[1:0] bitsMRUDS bitLPUDS bitLPDS bitFPDS bitWakeup latency
Under-drive ModeSTOP UMR-FPD31-0-HSI RC startup time +
Flash wakeup time from power-down mode +
Main regulator wakeup time from under-drive mode + Core logic to nominal mode
STOP ULP-FPD3-11-HSI RC startup time +
Flash wakeup time from power-down mode +
regulator wakeup time from LP under-drive mode + Core logic to nominal mode

I/O states in Stop mode

In stop mode, all I/Os pins keep the same state as in the run mode

Entering Stop mode

The Stop mode is entered according to Entering low-power mode , when the SLEEPDEEP bit in Cortex ® -M7 System Control register is set.

Refer to Table 18 for details on how to enter the Stop mode.

When the microcontroller enters in Stop mode, the voltage scale 3 is automatically selected. To further reduce power consumption in Stop mode, the internal voltage regulator can be put in low-power or low voltage mode. This is configured by the LPDS, MRUDS, LPUDS and UDEN bits of the PWR power control register (PWR_CR1) .

If Flash memory programming is ongoing, the Stop mode entry is delayed until the memory access is finished.

If an access to the APB domain is ongoing, The Stop mode entry is delayed until the APB access is finished.

If the Over-drive mode was enabled before entering Stop mode, it is automatically disabled during when the Stop mode is activated.

In Stop mode, the following features can be selected by programming individual control bits:

The ADC or DAC can also consume power during the Stop mode, unless they are disabled before entering it. To disable them, the ADON bit in the ADC_CR2 register and the ENx bit in the DAC_CR register must both be written to 0.

Note: Before entering Stop mode, it is recommended to enable the clock security system (CSS) feature to prevent external oscillator (HSE) failure from impacting the internal MCU behavior.

Exiting Stop mode

Refer to Table 18 for more details on how to exit Stop mode.

When exiting Stop mode by issuing an interrupt or a wakeup event, the HSI RC oscillator is selected as system clock.

If the Under-drive mode was enabled, it is automatically disabled after exiting Stop mode.

When the voltage regulator operates in low-power mode, an additional startup delay is incurred when waking up from Stop mode. By keeping the internal regulator ON during Stop mode, the consumption is higher although the startup time is reduced.

When the voltage regulator operates in Under-drive mode, an additional startup delay is induced when waking up from Stop mode.

Table 18. Stop mode entry and exit (STM32F75xxx and STM32F74xxx)

Stop modeDescription
Mode entry

WFI (Wait for Interrupt) or WFE (Wait for Event) while:

  • – No interrupt (for WFI) or event (for WFE) is pending.
  • – SLEEPDEEP bit is set in Cortex®-M7 System Control register,
  • – PDDS bit is cleared in Power Control register (PWR_CR1),
  • – Select the voltage regulator mode by configuring LPDS, MRUDS, LPUDS and UDEN bits in PWR_CR (see Table 17: Stop operating modes ).

On Return from ISR while:

  • – No interrupt is pending,
  • – SLEEPDEEP bit is set in Cortex®-M7 System Control register, and
  • – SLEEPONEXIT = 1, and
  • – PDDS is cleared in Power Control register (PWR_CR1).

Note: To enter Stop mode, all EXTI Line pending bits (in Pending register (EXTI_PR) ), all peripheral interrupts pending bits, the RTC Alarm (Alarm A and Alarm B), RTC wakeup, RTC tamper, and RTC time stamp flags, must be reset. Otherwise, the Stop mode entry procedure is ignored and program execution continues.

Table 18. Stop mode entry and exit (STM32F75xxx and STM32F74xxx) (continued)

Stop modeDescription
Mode exit

If WFI or Return from ISR was used for entry:
All EXTI lines configured in Interrupt mode (the corresponding EXTI Interrupt vector must be enabled in the NVIC). The interrupt source can be external interrupts or peripherals with wakeup capability. Refer to Table 44: STM32F75xxx and STM32F74xxx vector table on page 290 .

If WFE was used for entry and SEVONPEND = 0:
All EXTI Lines configured in event mode. Refer to Section 11.3: Wakeup event management on page 296

If WFE was used for entry and SEVONPEND = 1:

  • – Any EXTI lines configured in Interrupt mode (even if the corresponding EXTI Interrupt vector is disabled in the NVIC). The interrupt source can be external interrupts or peripherals with wakeup capability. Refer to Table 44: STM32F75xxx and STM32F74xxx vector table on page 290 .
  • – Wakeup event: refer to Section 11.3: Wakeup event management on page 296 .
Wakeup latencyRefer to Table 17: Stop operating modes

4.3.6 Standby mode

The Standby mode allows to achieve the lowest power consumption. It is based on the Cortex ® -M7 deepsleep mode, with the voltage regulator disabled. The 1.2 V domain is consequently powered off. The PLLs, the HSI oscillator and the HSE oscillator are also switched off. SRAM and register contents are lost except for registers in the backup domain (RTC registers, RTC backup register and backup SRAM), and Standby circuitry (see Figure 5 ).

Entering Standby mode

The Standby mode is entered according to Entering low-power mode, when the SLEEPDEEP bit in the Cortex ® -M7 System Control register is set.

Refer to Table 19 for more details on how to enter Standby mode.

In Standby mode, the following features can be selected by programming individual control bits:

Exiting Standby mode

The microcontroller exits Standby mode when an external Reset (NRST pin), an IWDG Reset, a rising or falling edge on WKUP pin, an RTC alarm, a tamper event, or a time stamp

event is detected. All registers are reset after wakeup from Standby except for PWR power control/status register (PWR_CSR1) .

After waking up from Standby mode, program execution restarts in the same way as after a Reset (boot pin sampling, vector reset is fetched, etc.). The SBF status flag in the PWR power control/status register (PWR_CSR1) indicates that the MCU was in Standby mode.

Refer to Table 19 for more details on how to exit Standby mode.

Table 19. Standby mode entry and exit

Standby modeDescription
Mode entry

WFI (Wait for Interrupt) or WFE (Wait for Event) while:

  • – SLEEPDEEP is set in Cortex ® -M7 System Control register,
  • – PDDS bit is set in Power Control register (PWR_CR1),
  • – No interrupt (for WFI) or event (for WFE) is pending,
  • – WUIF bit is cleared in Power Control and Status register (PWR_CSR1),
  • – the RTC flag corresponding to the chosen wakeup source (RTC Alarm A, RTC Alarm B, RTC wakeup, Tamper or Timestamp flags) is cleared.
  • – EIWUP bit is set in Power Control register (PWR_CSR1).

On return from ISR while:

  • – SLEEPDEEP bit is set in Cortex ® -M7 System Control register, and
  • – SLEEPONEXIT = 1, and
  • – PDDS bit is set in Power Control register (PWR_CR1), and
  • – No interrupt is pending,
  • – WUIF bit is cleared in Power Control and Status register (PWR_CSR1),
  • – The RTC flag corresponding to the chosen wakeup source (RTC Alarm A, RTC Alarm B, RTC wakeup, Tamper or Timestamp flags) is cleared.
Mode exitWKUP pin rising or falling edge, RTC alarm (Alarm A and Alarm B), RTC wakeup, tamper event, time stamp event, external reset in NRST pin, IWDG reset.
Wakeup latencyReset phase.

I/O states in Standby mode

In Standby mode, all I/O pins are high impedance except for:

4.3.7 Programming the RTC alternate functions to wake up the device from the Stop and Standby modes

The MCU can be woken up from a low-power mode by an RTC alternate function.

The RTC alternate functions are the RTC alarms (Alarm A and Alarm B), RTC wakeup, RTC tamper event detection and RTC time stamp event detection.

These RTC alternate functions can wake up the system from the Stop and Standby low-power modes.

The system can also wake up from low-power modes without depending on an external interrupt (Auto-wakeup mode), by using the RTC alarm or the RTC wakeup events.

The RTC provides a programmable time base for waking up from the Stop or Standby mode at regular intervals.

For this purpose, two of the three alternate RTC clock sources can be selected by programming the RTCSEL[1:0] bits in the RCC backup domain control register (RCC_BDCR) :

RTC alternate functions to wake up the device from the Stop mode

RTC alternate functions to wake up the device from the Standby mode

Safe RTC alternate function wakeup flag clearing sequence

To avoid bouncing on the pins onto which the RTC alternate functions are mapped, and exit correctly from the Stop and Standby modes, it is recommended to follow the sequence below before entering the Standby mode:

4.4 Power control registers

4.4.1 PWR power control register (PWR_CR1)

Address offset: 0x00

Reset value: 0x0000 C000 (reset by wakeup from Standby mode)

31302928272625242322212019181716
Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.UDEN[1:0]ODSWENODEN
rwrwrwrw

1514131211109876543210
VOS[1:0]ADCDC1Res.MRUDSLPUDSFPDSDBPPLS[2:0]PVDECSBFRes.PDDSLPDS
rwrwrwrwrwrwrwrwrwrwrwrc_w1rwrw

Bits 31:20 Reserved, must be kept at reset value.

Bits 19:18 UDEN[1:0] : Under-drive enable in stop mode

These bits are set by software. They allow to achieve a lower power consumption in Stop mode but with a longer wakeup time.
When set, the digital area has less leakage consumption when the device enters Stop mode.

Bit 17 ODSWEN : Over-drive switching enabled.

This bit is set by software. It is cleared automatically by hardware after exiting from Stop mode or when the ODEN bit is reset. When set, It is used to switch to Over-drive mode.
To set or reset the ODSWEN bit, the HSI or HSE must be selected as system clock.
The ODSWEN bit must only be set when the ODRDY flag is set to switch to Over-drive mode.

Note: On any over-drive switch (enabled or disabled), the system clock will be stalled during the internal voltage set up.

Bit 16 ODEN : Over-drive enable

This bit is set by software. It is cleared automatically by hardware after exiting from Stop mode. It is used to enabled the Over-drive mode in order to reach a higher frequency.
To set or reset the ODEN bit, the HSI or HSE must be selected as system clock. When the ODEN bit is set, the application must first wait for the Over-drive ready flag (ODRDY) to be set before setting the ODSWEN bit.

Bits 15:14 VOS[1:0] : Regulator voltage scaling output selection

These bits control the main internal voltage regulator output voltage to achieve a trade-off between performance and power consumption when the device does not operate at the maximum frequency (refer to the STM32F75xxx and STM32F74xxx datasheets for more details).

These bits can be modified only when the PLL is OFF. The new value programmed is active only when the PLL is ON. When the PLL is OFF, the voltage scale 3 is automatically selected.

00: Reserved (Scale 3 mode selected)

01: Scale 3 mode

10: Scale 2 mode

11: Scale 1 mode (reset value)

Bit 13 ADCD1 :

0: No effect.

1: Refer to AN4073 for details on how to use this bit.

Note: This bit can only be set when operating at supply voltage range 2.7 to 3.6V.

Bit 12 Reserved, must be kept at reset value.

Bit 11 MRUDS : Main regulator in deepsleep under-drive mode

This bit is set and cleared by software.

0: Main regulator ON when the device is in Stop mode

1: Main Regulator in under-drive mode and Flash memory in power-down when the device is in Stop under-drive mode.

Bit 10 LPUDS : Low-power regulator in deepsleep under-drive mode

This bit is set and cleared by software.

0: Low-power regulator ON if LPDS bit is set when the device is in Stop mode

1: Low-power regulator in under-drive mode if LPDS bit is set and Flash memory in power-down when the device is in Stop under-drive mode.

Bit 9 FPDS : Flash power-down in Stop mode

When set, the Flash memory enters power-down mode when the device enters Stop mode. This allows to achieve a lower consumption in stop mode but a longer restart time.

0: Flash memory not in power-down when the device is in Stop mode

1: Flash memory in power-down when the device is in Stop mode

Bit 8 DBP : Disable backup domain write protection

In reset state, the RCC_BDCR register, the RTC registers (including the backup registers), and the BRE bit of the PWR_CSR1 register, are protected against parasitic write access. This bit must be set to enable write access to these registers.

0: Access to RTC and RTC Backup registers and backup SRAM disabled

1: Access to RTC and RTC Backup registers and backup SRAM enabled

Bits 7:5 PLS[2:0] : PVD level selection

These bits are written by software to select the voltage threshold detected by the programmable voltage detector

Note: Refer to the electrical characteristics of the datasheet for more details.

Bit 4 PVDE : Programmable voltage detector enable

This bit is set and cleared by software.

Bit 3 CSBF : Clear standby flag

This bit is always read as 0.

Bit 2 Reserved, must be kept at reset value

Bit 1 PDDS : Power-down deepsleep

This bit is set and cleared by software. It works together with the LPDS bit.

Bit 0 LPDS : Low-power deepsleep

This bit is set and cleared by software. It works together with the PDDS bit.

4.4.2 PWR power control/status register (PWR_CSR1)

Address offset: 0x04

Reset value: 0x0000 0000 (not reset by wakeup from Standby mode)

Additional APB cycles are needed to read this register versus a standard APB read.

31302928272625242322212019181716
Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.UDRDY[1:0]ODSWRDYODRDY
rc_w1rc_w1rr
1514131211109876543210
Res.VOS RDYRes.Res.Res.Res.BREEIWUPRes.Res.Res.Res.BRRPVDOSBFWUIF
rrwrwrrrr

Bits 31:20 Reserved, must be kept at reset value.

Bits 19:18 UDRDY[1:0] : Under-drive ready flag

These bits are set by hardware when MCU enters stop Under-drive mode and exits. When the Under-drive mode is enabled, these bits are not set as long as the MCU has not entered stop mode yet. they are cleared by programming them to 1.
00: Under-drive is disabled
01: Reserved
10: Reserved
11:Under-drive mode is activated in Stop mode.

Bit 17 ODSWRDY : Over-drive mode switching ready

0: Over-drive mode is not active.

1: Over-drive mode is active on digital area on 1.2 V domain

Bit 16 ODRDY : Over-drive mode ready

0: Over-drive mode not ready.

1: Over-drive mode ready

Bit 14 VOSRDY : Regulator voltage scaling output selection ready bit

0: Not ready

1: Ready

Bits 13:10 Reserved, must be kept at reset value.

Bit 9 BRE : Backup regulator enable

When set, the Backup regulator (used to maintain backup SRAM content in Standby and \( V_{BAT} \) modes) is enabled. If BRE is reset, the backup regulator is switched off. The backup SRAM can still be used but its content will be lost in the Standby and \( V_{BAT} \) modes. Once set, the application must wait that the Backup Regulator Ready flag (BRR) is set to indicate that the data written into the RAM will be maintained in the Standby and \( V_{BAT} \) modes.

0: Backup regulator disabled

1: Backup regulator enabled

Note: This bit is not reset when the device wakes up from Standby mode or by a system reset or by a power reset. It is reset by a backup domain reset.

The DBP bit of PWR_CR register must be set to 1 before PWR_CSR.BRE can be written.

Bit 8 EIWUP : Enable internal wakeup

This bit must be set when RTC events (Alarm A or Alarm B, RTC Tamper, RTC TimeStamp or RTC Wakeup time) are used to wake up the system from Standby mode.

This bit is always read as 0.

0: Disable internal wakeup sources (RTC events) during Standby mode

1: Enable internal wakeup sources (RTC events) during Standby mode

Bits 7:4 Reserved, must be kept at reset value.

Bit 3 BRR : Backup regulator ready

Set by hardware to indicate that the Backup Regulator is ready.

0: Backup Regulator not ready

1: Backup Regulator ready

Note: This bit is not reset when the device wakes up from Standby mode or by a system reset or power reset.

Bit 2 PVDO : PVD output

This bit is set and cleared by hardware. It is valid only if PVD is enabled by the PVDE bit.

0: V DD is higher than the PVD threshold selected with the PLS[2:0] bits.

1: V DD is lower than the PVD threshold selected with the PLS[2:0] bits.

Note: The PVD is stopped by Standby mode. For this reason, this bit is equal to 0 after Standby or reset until the PVDE bit is set.

Bit 1 SBF : Standby flag

This bit is set by hardware and cleared only by a POR/PDR (power-on reset/power-down reset) or by setting the CSBF bit in the PWR power control register (PWR_CR1)

0: Device has not been in Standby mode

1: Device has been in Standby mode

Bit 0 WUIF : Wakeup internal flag

This bit is set when a wakeup is detected on the internal wakeup line in standby mode. It is cleared when all internal wakeup sources are cleared.

0: No wakeup internal event occurred

1: A wakeup event was detected from the RTC alarm (Alarm A or Alarm B), RTC Tamper event, RTC TimeStamp event or RTC Wakeup

4.4.3 PWR power control/status register 2 (PWR_CR2)

Address offset: 0x08

Reset value: 0x0000 0000 (not reset by wakeup from Standby mode)

31302928272625242322212019181716
Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.
1514131211109876543210
Res.Res.WUPP6WUPP5WUPP4WUPP3WUPP2WUPP1Res.Res.CWUPF6CWUPF5CWUPF4CWUPF3CWUPF2CWUPF1
rwrwrwrwrwrwrrrrrr

Bits 31:14 Reserved, always read as 0.

Bit 13 WUPP6 : Wakeup pin polarity bit for PI11

These bits define the polarity used for event detection on external wake-up pin PI11.

0: Detection on rising edge

1: Detection on falling edge

Bit 12 WUPP5 : Wakeup pin polarity bit for PI8

These bits define the polarity used for event detection on external wake-up pin PI8.

0: Detection on rising edge

1: Detection on falling edge

Bit 11 WUPP4 : Wakeup pin polarity bit for PC13

These bits define the polarity used for event detection on external wake-up pin PC13.

0: Detection on rising edge

1: Detection on falling edge

Bit 10 WUPP3 : Wakeup pin polarity bit for PC1

These bits define the polarity used for event detection on external wake-up pin PC1.

0: Detection on rising edge

1: Detection on falling edge

Bit 9 WUPP2 : Wakeup pin polarity bit for PA2

These bits define the polarity used for event detection on external wake-up pin PA2.

0: Detection on rising edge

1: Detection on falling edge

Bit 8 WUPP1 : Wakeup pin polarity bit for PA0

These bits define the polarity used for event detection on external wake-up pin PA0.

0: Detection on rising edge

1: Detection on falling edge

Bits 7:6 Reserved, always read as 0

Bit 5 CWUPF6 : Clear Wakeup Pin flag for PI11

These bits are always read as 0

0: No effect

1: Clear the WUPF Wakeup Pin flag after 2 System clock cycles.

Bit 4 CWUPF5 : Clear Wakeup Pin flag for PI8

These bits are always read as 0

0: No effect

1: Clear the WUPF Wakeup Pin flag after 2 System clock cycles.

Bit 3 CWUPF4 : Clear Wakeup Pin flag for PC13

These bits are always read as 0

0: No effect

1: Clear the WUPF Wakeup Pin flag after 2 System clock cycles.

Bit 2 CWUPF3 : Clear Wakeup Pin flag for PC1

These bits are always read as 0

0: No effect

1: Clear the WUPF Wakeup Pin flag after 2 System clock cycles.

Bit 1 CWUPF2 : Clear Wakeup Pin flag for PA2

These bits are always read as 0

0: No effect

1: Clear the WUPF Wakeup Pin flag after 2 System clock cycles.

Bit 0 CWUPF1 : Clear Wakeup Pin flag for PA0

These bits are always read as 0

0: No effect

1: Clear the WUPF Wakeup Pin flag after 2 System clock cycles.

4.4.4 PWR power control register 2 (PWR_CSR2)

Address offset: 0x0C

Reset value: 0x0000 0000 (reset by wakeup from Standby mode, except wakeup flags which are reset by RESET pin)

Additional APB cycles are needed to read this register versus a standard APB read.

31302928272625242322212019181716
Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.
1514131211109876543210
Res.Res.EWUP6EWUP5EWUP4EWUP3EWUP2EWUP1Res.Res.WUPF6WUPF5WUPF4WUPF3WUPF2WUPF1
rwrwrwrwrwrwrrrrrr

Bits 31:14 Reserved, always read as 0.

Bit 13 EWUP6 : Enable Wakeup pin for PI11

This bit is set and cleared by software.

0: An event on WKUP pin PI11 does not wake-up the device from Standby mode.

1: A rising or falling edge on WKUP pin PI11 wakes-up the system from Standby mode.

Bit 12 EWUP5 : Enable Wakeup pin for PI8

This bit is set and cleared by software.

0: An event on WKUP pin PI8 does not wake-up the device from Standby mode.

1: A rising or falling edge on WKUP pin PI8 wakes-up the system from Standby mode.

Bit 11 EWUP4 : Enable Wakeup pin for PC13

This bit is set and cleared by software.

0: An event on WKUP pin PC13 does not wake-up the device from Standby mode.

1: A rising or falling edge on WKUP pin PC13 wakes-up the system from Standby mode.

Bit 10 EWUP3 : Enable Wakeup pin for PC1

This bit is set and cleared by software.

0: An event on WKUP pin PC1 does not wake-up the device from Standby mode.

1: A rising or falling edge on WKUP pin PC1 wakes-up the system from Standby mode.

Bit 9 EWUP2 : Enable Wakeup pin for PA2

This bit is set and cleared by software.

0: An event on WKUP pin PA2 does not wake-up the device from Standby mode.

1: A rising or falling edge on WKUP pin PA2 wakes-up the system from Standby mode.

Bit 8 EWUP1 : Enable Wakeup pin for PA0

This bit is set and cleared by software.

0: An event on WKUP pin PA0 does not wake-up the device from Standby mode.

1: A rising or falling edge on WKUP pin PA0 wakes-up the system from Standby mode.

Bits 7:6 Reserved, always read as 0

Bit 5 WUPF6 : Wakeup Pin flag for PI11

This bit is set by hardware and cleared only by a Reset pin or by setting the CWUPF6 bit in the PWR power control register 2 (PWR_CR2).

0: No Wakeup event occurred

1: A wakeup event is detected on WKUP PI11

Note: An additional wakeup event is detected if WKUP pin is enabled (by setting the EWUP6 bit) when WKUP pin PI11 level is already high.

Bit 4 WUPF5 : Wakeup Pin flag for PI8

This bit is set by hardware and cleared only by a Reset pin or by setting the CWUPF5 bit in the PWR power control register 2 (PWR_CR2).

0: No Wakeup event occurred

1: A wakeup event is detected on WKUP PI8

Note: An additional wakeup event is detected if WKUP pin is enabled (by setting the EWUP5 bit) when WKUP pin PI8 level is already high.

Bit 3 WUPF4 : Wakeup Pin flag for PC13

This bit is set by hardware and cleared only by a Reset pin or by setting the CWUPF4 bit in the PWR power control register 2 (PWR_CR2).

0: No Wakeup event occurred

1: A wakeup event is detected on WKUP PC13

Note: An additional wakeup event is detected if WKUP pin is enabled (by setting the EWUP4 bit) when WKUP pin PC13 level is already high.

Bit 2 WUPF3 : Wakeup Pin flag for PC1

This bit is set by hardware and cleared only by a Reset pin or by setting the CWUPF3 bit in the PWR power control register 2 (PWR_CR2).

0: No Wakeup event occurred

1: A wakeup event is detected on WKUP PC1

Note: An additional wakeup event is detected if WKUP pin is enabled (by setting the EWUP3 bit) when WKUP pin PC1 level is already high.

Bit 1 WUPF2 : Wakeup Pin flag for PA2

This bit is set by hardware and cleared only by a Reset pin or by setting the CWUPF2 bit in the PWR power control register 2 (PWR_CR2).

0: No Wakeup event occurred

1: A wakeup event is detected on WKUP PA2

Note: An additional wakeup event is detected if WKUP pin is enabled (by setting the EWUP2 bit) when WKUP pin PA2 level is already high.

Bit 0 WUPF1 : Wakeup Pin flag for PA0

This bit is set by hardware and cleared only by a Reset pin or by setting the CWUPF1 bit in the PWR power control register 2 (PWR_CR2).

0: No Wakeup event occurred

1: A wakeup event is detected on WKUP PA0

Note: An additional wakeup event is detected if WKUP pin is enabled (by setting the EWUP1 bit) when WKUP pin PA0 level is already high.

4.5 PWR register map

The following table summarizes the PWR registers.

Table 20. PWR - register map and reset values

OffsetRegister313029282726252423222120191817161514131211109876543210
0x000PWR_CR1Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.UDEN[1:0]ODSWENODENVOS[1:0]ADDCDC1Res.MRUDSLPUDSFPDSDBPPLS[2:0]PVDECSBFRes.PDDSLPDS
Reset value1111110110000000000
0x004PWR_CSR1Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.UDRDY[1:0]ODSWRDYODRDYRes.VOSRDYRes.Res.Res.Res.BREEIWPRes.Res.Res.Res.BRRPVDOSBFWUIF
Reset value00000000000
0x008PWR_CR2Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.EWUP6WUPP6EWUP5WUPP5EWUP4WUPP4EWUP3WUPP3EWUP2WUPP2EWUP1WUPP1Res.Res.
Reset value00000000000000
0x00CPWR_CSR2Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.Res.EWUP6WUPP6EWUP5WUPP5EWUP4WUPP4EWUP3WUPP3EWUP2WUPP2EWUP1WUPP1Res.Res.
Reset value00000000000000

Refer to Section 2.2 on page 69 for the register boundary addresses.